BSC9131NSE7KHKB vs BSC9131NJN1HHHB557 Comparaison
Comparaison détaillée côte à côte de BSC9131NSE7KHKB par NXP Semiconductors et BSC9131NJN1HHHB557 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | BSC9131NSE7KHKB | BSC9131NJN1HHHB557 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | DSP | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Processor Type | QorIQ Qonverge SoC | QorIQ Qonverge multicore baseband processor |
| CPU Core | 1 core, 32-bit e500 PowerPC | — |
| CPU Frequency | 1 GHz | — |
| DSP Engine | 1 GHz StarCore DSP | — |
| Accelerator | MAPLE-B2F | — |
| Core Count | 1 core | [DATA_NEEDED: core count] |
| Architecture | 32-bit | — |
| Memory Support | DDR3 | — |
| Interface | IFC | — |
| Security Feature | SEC | — |
| Plage de température de fonctionnement | 0 °C to +105 °C | [DATA_NEEDED: operating temperature range] |
| Boîtier | 520-FCBGA | — |
| Package Dimensions | 21 mm × 21 mm | — |
| Type de montage | Surface mount | Surface Mount |
| Processor Category | Microprocessor IC | Embedded MPU / communications processor |
| Supplier Price | $54.9669 per unit as of 2026-10-23 | — |
| Reported Supplier Stock | 5,760 pieces | — |
| Lead Time | To be confirmed | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Maximum Processor Frequency | — | 800 MHz |
| Package Type | — | 520-FCBGA |
| Ball Count | — | 520 balls |
| Package Technology | — | Flip-chip ball grid array |
| Memory Interface | — | [DATA_NEEDED: memory interface type and configuration] |
| Network and Serial Interfaces | — | [DATA_NEEDED: network and serial interface list] |
| Input Supply Voltage | — | [DATA_NEEDED: input supply voltage range] |
| I/O Voltage | — | [DATA_NEEDED: I/O voltage range] |
| Résistance thermique | — | [DATA_NEEDED: thermal resistance] |
| Maximum Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| Physical Dimensions | — | [DATA_NEEDED: package dimensions] |
| Statut du cycle de vie | — | Active; in-stock listing reported by LCSC |
| Manufacturer | — | NXP Semiconductors |