BSC9131NSE7KHKB vs BSC9131NJN1HHHB557 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci BSC9131NSE7KHKB disebabkan oleh NXP Semiconductors dan BSC9131NJN1HHHB557 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | BSC9131NSE7KHKB | BSC9131NJN1HHHB557 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | DSP | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Processor Type | QorIQ Qonverge SoC | QorIQ Qonverge multicore baseband processor |
| CPU Core | 1 core, 32-bit e500 PowerPC | — |
| CPU Frequency | 1 GHz | — |
| DSP Engine | 1 GHz StarCore DSP | — |
| Accelerator | MAPLE-B2F | — |
| Core Count | 1 core | [DATA_NEEDED: core count] |
| Architecture | 32-bit | — |
| Memory Support | DDR3 | — |
| Antaramuka | IFC | — |
| Security Feature | SEC | — |
| Gambaran Suhu Operasi | 0 °C to +105 °C | [DATA_NEEDED: operating temperature range] |
| Kemasan | 520-FCBGA | — |
| Package Dimensions | 21 mm × 21 mm | — |
| Jenis Pemasangan | Surface mount | Surface Mount |
| Processor Category | Microprocessor IC | Embedded MPU / communications processor |
| Supplier Price | $54.9669 per unit as of 2026-10-23 | — |
| Reported Supplier Stock | 5,760 pieces | — |
| Lead Time | To be confirmed | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Maximum Processor Frequency | — | 800 MHz |
| Package Type | — | 520-FCBGA |
| Ball Count | — | 520 balls |
| Package Technology | — | Flip-chip ball grid array |
| Memory Interface | — | [DATA_NEEDED: memory interface type and configuration] |
| Network and Serial Interfaces | — | [DATA_NEEDED: network and serial interface list] |
| Input Supply Voltage | — | [DATA_NEEDED: input supply voltage range] |
| I/O Voltage | — | [DATA_NEEDED: I/O voltage range] |
| Tegangan Panas | — | [DATA_NEEDED: thermal resistance] |
| Maximum Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| Physical Dimensions | — | [DATA_NEEDED: package dimensions] |
| Status Lingkungan Hidup | — | Active; in-stock listing reported by LCSC |
| Manufacturer | — | NXP Semiconductors |