DSP56303AG100R2 vs DSPB56367AG150 Comparison
Detailed side-by-side comparison of DSP56303AG100R2 by NXP Semiconductors and DSPB56367AG150 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
DSPB56367AG150 - 150MHz 24-Bit Audio DSP | NXP Semiconductors
DSPB56367AG150 ✗ End of LifeSpecification Comparison
| Parameter | DSP56303AG100R2 | DSPB56367AG150 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | DSP | DSP |
| Lifecycle Status | NRND | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $16.40 | $52.90 |
| Core Architecture | DSP56300 family, 24-bit fixed-point | — |
| Core Clock Frequency | 100 MHz | — |
| Instruction Throughput | 100 MIPS | — |
| Data Path Width | 24-bit ALU with 56-bit accumulator | — |
| On-Chip Data RAM | 24 KB | — |
| Bootstrap ROM | 576 B | — |
| External Memory Expansion | Yes (Program, X-data, Y-data) | — |
| Host Interface | HI08 (8-bit parallel host port) | — |
| Serial Interfaces | 2x ESSI, 1x SCI | — |
| Timers | Triple Timer module | — |
| Core Supply Voltage | 1.8 V (typical) | — |
| I/O Supply Voltage | 3.3 V | — |
| Package | 144-LQFP (20x20 mm) | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | — |
| Mounting Type | Surface Mount | Surface Mount |
| MSL Level | [DATA_NEEDED: MSL rating] | — |
| RoHS Status | [DATA_NEEDED: RoHS compliance] | Lead Free (per Mouser listing) |
| Core Type | — | DSP56300 24-bit fixed-point DSP core |
| Maximum Clock Frequency | — | 150 MHz |
| Program Memory Type | — | ROM |
| Non-Volatile Memory (ROM) | — | 240 kB |
| On-Chip RAM | — | 69 kB |
| Data Bus Width | — | 24 bit |
| Interfaces | — | Host Interface, I2C, SAI, SPI |
| Application Type | — | Audio Processor |
| Supply Voltage | — | [DATA_NEEDED: Supply Voltage] |
| Operating Temperature Range | — | [DATA_NEEDED: Operating Temperature Range] |
| Package / Case | — | 144-LQFP (20x20 mm) |
| Terminal Form | — | Gull Wing |
| Packaging | — | Tray |
| Qualification | — | Not Qualified (per Partstack) |
| Lifecycle Status | — | End of Life (per NXP product page) |