DSP56303AG100R2 vs DSPB56367AG150 Vergleich
Detaillierter Direktvergleich von DSP56303AG100R2 von NXP Semiconductors und DSPB56367AG150 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
DSPB56367AG150 - 150MHz 24-Bit Audio DSP | NXP Semiconductors
DSPB56367AG150 ✗ AbgekündigtSpezifikationsvergleich
| Parameter | DSP56303AG100R2 | DSPB56367AG150 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | NRND | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $16,40 | $52,90 |
| Core Architecture | DSP56300 family, 24-bit fixed-point | — |
| Core Clock Frequency | 100 MHz | — |
| Instruction Throughput | 100 MIPS | — |
| Data Path Width | 24-bit ALU with 56-bit accumulator | — |
| On-Chip Data RAM | 24 KB | — |
| Bootstrap ROM | 576 B | — |
| External Memory Expansion | Yes (Program, X-data, Y-data) | — |
| Host Interface | HI08 (8-bit parallel host port) | — |
| Serial Interfaces | 2x ESSI, 1x SCI | — |
| Timers | Triple Timer module | — |
| Core Supply Voltage | 1.8 V (typical) | — |
| I/O Supply Voltage | 3.3 V | — |
| Gehäuse | 144-LQFP (20x20 mm) | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance] | Lead Free (per Mouser listing) |
| Core Type | — | DSP56300 24-bit fixed-point DSP core |
| Maximale Taktfrequenz | — | 150 MHz |
| Program Memory Type | — | ROM |
| Non-Volatile Memory (ROM) | — | 240 kB |
| On-Chip RAM | — | 69 kB |
| Datenbusbreite | — | 24 bit |
| Interfaces | — | Host Interface, I2C, SAI, SPI |
| Application Type | — | Audio Processor |
| Versorgungsspannung | — | [DATA_NEEDED: Supply Voltage] |
| Betriebstemperaturbereich | — | [DATA_NEEDED: Operating Temperature Range] |
| Gehäuse / Bauform | — | 144-LQFP (20x20 mm) |
| Terminal Form | — | Gull Wing |
| Packaging | — | Tray |
| Qualification | — | Not Qualified (per Partstack) |
| Lebenszyklusstatus | — | End of Life (per NXP product page) |