DSP56303AG100R2 vs DSPB56367AG150 Comparación
Comparación detallada lado a lado de DSP56303AG100R2 por NXP Semiconductors y DSPB56367AG150 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
DSPB56367AG150 - 150MHz 24-Bit Audio DSP | NXP Semiconductors
DSPB56367AG150 ✗ Fin de vidaComparación de especificaciones
| Parámetro | DSP56303AG100R2 | DSPB56367AG150 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | DSP | DSP |
| Estado del ciclo de vida | NRND | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $16,40 | $52,90 |
| Core Architecture | DSP56300 family, 24-bit fixed-point | — |
| Core Clock Frequency | 100 MHz | — |
| Instruction Throughput | 100 MIPS | — |
| Data Path Width | 24-bit ALU with 56-bit accumulator | — |
| On-Chip Data RAM | 24 KB | — |
| Bootstrap ROM | 576 B | — |
| External Memory Expansion | Yes (Program, X-data, Y-data) | — |
| Host Interface | HI08 (8-bit parallel host port) | — |
| Serial Interfaces | 2x ESSI, 1x SCI | — |
| Timers | Triple Timer module | — |
| Core Supply Voltage | 1.8 V (typical) | — |
| I/O Supply Voltage | 3.3 V | — |
| Encapsulado | 144-LQFP (20x20 mm) | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance] | Lead Free (per Mouser listing) |
| Core Type | — | DSP56300 24-bit fixed-point DSP core |
| Frecuencia de reloj máxima | — | 150 MHz |
| Program Memory Type | — | ROM |
| Non-Volatile Memory (ROM) | — | 240 kB |
| On-Chip RAM | — | 69 kB |
| Ancho del bus de datos | — | 24 bit |
| Interfaces | — | Host Interface, I2C, SAI, SPI |
| Application Type | — | Audio Processor |
| Tensión de alimentación | — | [DATA_NEEDED: Supply Voltage] |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: Operating Temperature Range] |
| Encapsulado / Carcasa | — | 144-LQFP (20x20 mm) |
| Terminal Form | — | Gull Wing |
| Packaging | — | Tray |
| Qualification | — | Not Qualified (per Partstack) |
| Estado del ciclo de vida | — | End of Life (per NXP product page) |