EP1K30FI256-2N vs EP1K10FI256-2N Comparison
Detailed side-by-side comparison of EP1K30FI256-2N by Intel and EP1K10FI256-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1K30FI256-2N | EP1K10FI256-2N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Last Time Buy |
| Family | ACEX-1K | ACEX 1K |
| Typical Gates | 30,000 | 10,000 |
| Logic Elements (LEs) | 1,728 | — |
| Embedded RAM Bits | 24,576 | — |
| Maximum User I/O | 171 | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V | — |
| Maximum Internal Frequency | 200 MHz | 200 MHz |
| Number of LABs | 216 | — |
| Package | 256-ball FineLine BGA (FBGA) | 256-Ball FBGA (FineLine BGA, 1.0 mm pitch) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | — |
| Speed Grade | -2 | -2 |
| Programmable via | JTAG (IEEE 1149.1) | — |
| Memory Type | Dual-port Embedded Array Block (EAB) | — |
| Logic Elements (Cells) | — | 576 |
| Embedded Array Blocks (EABs) | — | 3 (12,288 RAM bits) |
| Total RAM Bits | — | 12,288 |
| User I/O Count | — | 136 |
| Core Voltage | — | 2.5 V |
| Operating Temperature | — | -40 °C to +85 °C (Industrial) |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |
| RoHS Status | — | [DATA_NEEDED: RoHS compliance status] |
| MSL Level | — | [DATA_NEEDED: moisture sensitivity level] |