EP1K50FC256-3 vs EP1K50FC256-3AA Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP1K50FC256-3 sa pamamagitan ng Intel at EP1K50FC256-3AA sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP1K50FC256-3 EP1K50FC256-3AA
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Obsolete
Series ACEX-1K ACEX-1K
Family ACEX 1K ACEX 1K Device Family (2.5V)
Logic Elements (LEs) 2,880 —
Typical Gates 50,000 —
Embedded RAM Bits 40,960 —
Logic Array Blocks (LABs) 360 —
Embedded Array Blocks (EABs) 12 —
Maximum User I/O 186 —
Core Voltage 2.5 V 2.5 V (2.375 V to 2.625 V)
Process Technology 0.22 um CMOS 0.22 µm CMOS SRAM
Maximum Frequency 166.67 MHz —
Speed Grade -3 -3 (faster tier)
Packhaging 256-pin FineLine BGA (FBGA-256) 256-BGA (FBGA, 17x17 mm)
Package Dimensions 17 x 17 mm —
Temperature na Operasyon Commercial (0C to +70C) [DATA_NEEDED: exact operating temp grade] 0 °C to 70 °C (commercial)
Uri ng Pagpapasok Surface Mount Surface Mount
Programming Interface JTAG (IEEE 1149.1), ByteBlaster —
Number of Logic Elements — 2880
Number of LABs (Logic Array Blocks) — 360
Total RAM Bits — 40960
Number of I/O Pins — 186
Number of Gates — 50000 (typical)
Configuration Method — SRAM (volatile, requires external config device)
Number of PLLs — 4 (per family datasheet)
Number of Global Clocks — [DATA_NEEDED: number of global clocks]
Tindminan RoHS — non_compliant (legacy BGA, pre-RoHS or exemption dependent on date code)

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