EP1K50TI144-1X vs EP1K30TI144-3N Comparison
Detailed side-by-side comparison of EP1K50TI144-1X by Intel and EP1K30TI144-3N by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1K50TI144-1X | EP1K30TI144-3N |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $10.95 | $21.80 |
| Family | ACEX 1K | ACEX 1K |
| Series | EP1K50 | EP1K30 |
| Device Type | FPGA (Field Programmable Gate Array) | β |
| Equivalent Gates | 50,000 | β |
| Logic Elements / Cells | 2,880 | β |
| Configurable Logic Blocks (CLBs) | 360 | β |
| Maximum User I/O Pins | 102 | 102 |
| Dedicated Input Pins | 6 | 6 |
| Number of Terminals | 144 | β |
| Package Code | QFP / TQFP-144 (Industrial) | β |
| Package Style | Low-profile Fine-pitch Quad Flat Pack (LFQFP / LQFP), 0.5 mm pitch | β |
| Terminal Form | Gull Wing | β |
| Supply Voltage (VCCINT) | 2.375 V to 2.625 V (nominal 2.5 V) | β |
| Maximum Clock Frequency | 90 MHz | β |
| Operating Temperature | -40 C to +85 C (Industrial) | -40C to +85C (Industrial) |
| Configuration Method | Volatile SRAM, external configuration device required | β |
| Mounting Type | Surface Mount | Surface Mount (Gull-Wing) |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Speed Grade | -1 (slowest, lowest cost) | -3 (fastest in EP1K30 family) |
| Design Toolchain | Quartus II (legacy support) | β |
| Logic Elements | β | 1,728 |
| Typical Gates | β | 30,000 |
| Usable Gates | β | 17,500 |
| Embedded Memory (EAB) | β | 24 Kbit (6 EABs of 4 Kbit each) |
| Total Terminals | β | 144 |
| Package | β | TQFP-144 (0.5 mm pitch) |
| Core Supply Voltage | β | 2.5 V nominal (2.375 V min, 2.625 V max) |
| Process Technology | β | 0.18 um CMOS, 4 metal layers |
| Configuration Modes | β | Passive Serial, Passive Parallel Async, Passive Parallel Sync, JTAG (IEEE 1149.1) |
| PLLs | β | 4 |
| Thermal Resistance (theta_JA) | β | Approximately 35-40 C/W (PCB-dependent) |