EP1K50TI144-1X vs EP1K30TI144-3N Comparaison
Comparaison détaillée côte à côte de EP1K50TI144-1X par Intel et EP1K30TI144-3N par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1K50TI144-1X | EP1K30TI144-3N |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $10,95 | $21,80 |
| Family | ACEX 1K | ACEX 1K |
| Series | EP1K50 | EP1K30 |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Equivalent Gates | 50,000 | — |
| Logic Elements / Cells | 2,880 | — |
| Configurable Logic Blocks (CLBs) | 360 | — |
| Maximum User I/O Pins | 102 | 102 |
| Dedicated Input Pins | 6 | 6 |
| Number of Terminals | 144 | — |
| Package Code | QFP / TQFP-144 (Industrial) | — |
| Package Style | Low-profile Fine-pitch Quad Flat Pack (LFQFP / LQFP), 0.5 mm pitch | — |
| Terminal Form | Gull Wing | — |
| Supply Voltage (VCCINT) | 2.375 V to 2.625 V (nominal 2.5 V) | — |
| Fréquence d'horloge maximale | 90 MHz | — |
| Température de fonctionnement | -40 C to +85 C (Industrial) | -40C to +85C (Industrial) |
| Configuration Method | Volatile SRAM, external configuration device required | — |
| Type de montage | Surface Mount | Surface Mount (Gull-Wing) |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Speed Grade | -1 (slowest, lowest cost) | -3 (fastest in EP1K30 family) |
| Design Toolchain | Quartus II (legacy support) | — |
| Logic Elements | — | 1,728 |
| Typical Gates | — | 30,000 |
| Usable Gates | — | 17,500 |
| Embedded Memory (EAB) | — | 24 Kbit (6 EABs of 4 Kbit each) |
| Total Terminals | — | 144 |
| Boîtier | — | TQFP-144 (0.5 mm pitch) |
| Core Supply Voltage | — | 2.5 V nominal (2.375 V min, 2.625 V max) |
| Process Technology | — | 0.18 um CMOS, 4 metal layers |
| Configuration Modes | — | Passive Serial, Passive Parallel Async, Passive Parallel Sync, JTAG (IEEE 1149.1) |
| PLLs | — | 4 |
| Thermal Resistance (theta_JA) | — | Approximately 35-40 C/W (PCB-dependent) |