EP1K50TI144-1X vs EP1K30TI144-3N Comparación
Comparación detallada lado a lado de EP1K50TI144-1X por Intel y EP1K30TI144-3N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1K50TI144-1X | EP1K30TI144-3N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10,95 | $21,80 |
| Family | ACEX 1K | ACEX 1K |
| Series | EP1K50 | EP1K30 |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Equivalent Gates | 50,000 | — |
| Logic Elements / Cells | 2,880 | — |
| Configurable Logic Blocks (CLBs) | 360 | — |
| Maximum User I/O Pins | 102 | 102 |
| Dedicated Input Pins | 6 | 6 |
| Number of Terminals | 144 | — |
| Package Code | QFP / TQFP-144 (Industrial) | — |
| Package Style | Low-profile Fine-pitch Quad Flat Pack (LFQFP / LQFP), 0.5 mm pitch | — |
| Terminal Form | Gull Wing | — |
| Supply Voltage (VCCINT) | 2.375 V to 2.625 V (nominal 2.5 V) | — |
| Frecuencia de reloj máxima | 90 MHz | — |
| Temperatura de funcionamiento | -40 C to +85 C (Industrial) | -40C to +85C (Industrial) |
| Configuration Method | Volatile SRAM, external configuration device required | — |
| Tipo de montaje | Surface Mount | Surface Mount (Gull-Wing) |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Speed Grade | -1 (slowest, lowest cost) | -3 (fastest in EP1K30 family) |
| Design Toolchain | Quartus II (legacy support) | — |
| Logic Elements | — | 1,728 |
| Typical Gates | — | 30,000 |
| Usable Gates | — | 17,500 |
| Embedded Memory (EAB) | — | 24 Kbit (6 EABs of 4 Kbit each) |
| Total Terminals | — | 144 |
| Encapsulado | — | TQFP-144 (0.5 mm pitch) |
| Core Supply Voltage | — | 2.5 V nominal (2.375 V min, 2.625 V max) |
| Process Technology | — | 0.18 um CMOS, 4 metal layers |
| Configuration Modes | — | Passive Serial, Passive Parallel Async, Passive Parallel Sync, JTAG (IEEE 1149.1) |
| PLLs | — | 4 |
| Thermal Resistance (theta_JA) | — | Approximately 35-40 C/W (PCB-dependent) |