EP1K50TI144-1X - 50K Gate ACEX 1K FPGA, 144-LQFP | Intel / Altera
MPN: EP1K50TI144-1X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $12.1 | $6,050.00 |
| 1,000 | $10.95 | $10,950.00 |
Drop-in alternatives for EP1K50TI144-1X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K50TI144-2N
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View Datasheet →EP1K50TI144-3N
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View Datasheet →EP1K30TI144-2N
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View Datasheet →EP1K30TI144-3N
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$21.8 / Unit
View Datasheet →EP1C6T144C8N
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View Datasheet →EP1K50TI144-1X Maximum Ratings & Electrical Characteristics
| Family | ACEX 1K |
| Series | EP1K50 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Equivalent Gates | 50,000 |
| Logic Elements / Cells | 2,880 |
| Configurable Logic Blocks (CLBs) | 360 |
| Maximum User I/O Pins | 102 |
| Dedicated Input Pins | 6 |
| Number of Terminals | 144 |
| Package Code | QFP / TQFP-144 (Industrial) |
| Package Style | Low-profile Fine-pitch Quad Flat Pack (LFQFP / LQFP), 0.5 mm pitch |
| Terminal Form | Gull Wing |
| Supply Voltage (VCCINT) | 2.375 V to 2.625 V (nominal 2.5 V) |
| Maximum Clock Frequency | 90 MHz |
| Operating Temperature | -40 C to +85 C (Industrial) |
| Configuration Method | Volatile SRAM, external configuration device required |
| Mounting Type | Surface Mount |
| Speed Grade | -1 (slowest, lowest cost) |
| Design Toolchain | Quartus II (legacy support) |
EP1K50TI144-1X Pin Configuration
| Pin 1 | GND — Ground |
| Pin 2 | I/O — User I/O pin (bank 1) |
| Pin 3 | I/O — User I/O pin (bank 1) |
| Pin 4 | I/O — User I/O pin (bank 1) |
| Pin 5 | I/O — User I/O pin (bank 1) |
| Pin 6 | I/O — User I/O pin (bank 1) |
| Pin 7 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 8 | I/O — User I/O pin (bank 1) |
| Pin 9 | I/O — User I/O pin (bank 1) |
| Pin 10 | I/O — User I/O pin (bank 1) |
| Pin 11 | I/O — User I/O pin (bank 1) |
| Pin 12 | I/O — User I/O pin (bank 1) |
| Pin 13 | GND — Ground |
| Pin 14 | I/O — User I/O pin (bank 1) |
| Pin 15 | I/O — User I/O pin (bank 1) |
| Pin 16 | I/O — User I/O pin (bank 1) |
| Pin 17 | I/O — User I/O pin (bank 1) |
| Pin 18 | I/O — User I/O pin (bank 1) |
| Pin 19 | I/O — User I/O pin (bank 1) |
| Pin 20 | I/O — User I/O pin (bank 1) |
| Pin 21 | VCCINT — Core supply voltage (2.5 V) |
| Pin 22 | GND — Ground |
| Pin 23 | I/O — User I/O pin (bank 2) |
| Pin 24 | I/O — User I/O pin (bank 2) |
| Pin 25 | I/O — User I/O pin (bank 2) |
| Pin 26 | I/O — User I/O pin (bank 2) |
| Pin 27 | I/O — User I/O pin (bank 2) |
| Pin 28 | I/O — User I/O pin (bank 2) |
| Pin 29 | I/O — User I/O pin (bank 2) |
| Pin 30 | I/O — User I/O pin (bank 2) |
| Pin 31 | VCCIO2 — I/O bank 2 supply voltage |
| Pin 32 | I/O — User I/O pin (bank 2) |
| Pin 33 | I/O — User I/O pin (bank 2) |
| Pin 34 | I/O — User I/O pin (bank 2) |
| Pin 35 | I/O — User I/O pin (bank 2) |
| Pin 36 | GND — Ground |
| Pin 37 | I/O — User I/O pin (bank 2) |
| Pin 38 | I/O — User I/O pin (bank 2) |
| Pin 39 | I/O — User I/O pin (bank 2) |
| Pin 40 | I/O — User I/O pin (bank 2) |
| Pin 41 | I/O — User I/O pin (bank 2) |
| Pin 42 | I/O — User I/O pin (bank 2) |
| Pin 43 | VCCINT — Core supply voltage (2.5 V) |
| Pin 44 | GND — Ground |
| Pin 45 | I/O — User I/O pin (bank 3) |
| Pin 46 | I/O — User I/O pin (bank 3) |
| Pin 47 | I/O — User I/O pin (bank 3) |
| Pin 48 | I/O — User I/O pin (bank 3) |
| Pin 49 | I/O — User I/O pin (bank 3) |
| Pin 50 | I/O — User I/O pin (bank 3) |
| Pin 51 | I/O — User I/O pin (bank 3) |
| Pin 52 | I/O — User I/O pin (bank 3) |
| Pin 53 | I/O — User I/O pin (bank 3) |
| Pin 54 | VCCIO3 — I/O bank 3 supply voltage |
| Pin 55 | I/O — User I/O pin (bank 3) |
| Pin 56 | I/O — User I/O pin (bank 3) |
| Pin 57 | I/O — User I/O pin (bank 3) |
| Pin 58 | I/O — User I/O pin (bank 3) |
| Pin 59 | GND — Ground |
| Pin 60 | I/O — User I/O pin (bank 3) |
| Pin 61 | I/O — User I/O pin (bank 3) |
| Pin 62 | I/O — User I/O pin (bank 3) |
| Pin 63 | I/O — User I/O pin (bank 3) |
| Pin 64 | I/O — User I/O pin (bank 3) |
| Pin 65 | I/O — User I/O pin (bank 3) |
| Pin 66 | VCCINT — Core supply voltage (2.5 V) |
| Pin 67 | GND — Ground |
| Pin 68 | I/O — User I/O pin (bank 4) |
| Pin 69 | I/O — User I/O pin (bank 4) |
| Pin 70 | I/O — User I/O pin (bank 4) |
| Pin 71 | I/O — User I/O pin (bank 4) |
| Pin 72 | I/O — User I/O pin (bank 4) |
| Pin 73 | I/O — User I/O pin (bank 4) |
| Pin 74 | I/O — User I/O pin (bank 4) |
| Pin 75 | I/O — User I/O pin (bank 4) |
| Pin 76 | VCCIO4 — I/O bank 4 supply voltage |
| Pin 77 | I/O — User I/O pin (bank 4) |
| Pin 78 | I/O — User I/O pin (bank 4) |
| Pin 79 | I/O — User I/O pin (bank 4) |
| Pin 80 | I/O — User I/O pin (bank 4) |
| Pin 81 | GND — Ground |
| Pin 82 | I/O — User I/O pin (bank 4) |
| Pin 83 | I/O — User I/O pin (bank 4) |
| Pin 84 | I/O — User I/O pin (bank 4) |
| Pin 85 | I/O — User I/O pin (bank 4) |
| Pin 86 | I/O — User I/O pin (bank 4) |
| Pin 87 | VCCINT — Core supply voltage (2.5 V) |
| Pin 88 | GND — Ground |
| Pin 89 | I/O — User I/O pin (bank 5) |
| Pin 90 | I/O — User I/O pin (bank 5) |
| Pin 91 | I/O — User I/O pin (bank 5) |
| Pin 92 | I/O — User I/O pin (bank 5) |
| Pin 93 | I/O — User I/O pin (bank 5) |
| Pin 94 | I/O — User I/O pin (bank 5) |
| Pin 95 | I/O — User I/O pin (bank 5) |
| Pin 96 | I/O — User I/O pin (bank 5) |
| Pin 97 | I/O — User I/O pin (bank 5) |
| Pin 98 | VCCIO5 — I/O bank 5 supply voltage |
| Pin 99 | I/O — User I/O pin (bank 5) |
| Pin 100 | I/O — User I/O pin (bank 5) |
| Pin 101 | I/O — User I/O pin (bank 5) |
| Pin 102 | I/O — User I/O pin (bank 5) |
| Pin 103 | GND — Ground |
| Pin 104 | I/O — User I/O pin (bank 5) |
| Pin 105 | I/O — User I/O pin (bank 5) |
| Pin 106 | I/O — User I/O pin (bank 5) |
| Pin 107 | I/O — User I/O pin (bank 5) |
| Pin 108 | I/O — User I/O pin (bank 5) |
| Pin 109 | VCCINT — Core supply voltage (2.5 V) |
| Pin 110 | GND — Ground |
| Pin 111 | I/O — User I/O pin (bank 6) |
| Pin 112 | I/O — User I/O pin (bank 6) |
| Pin 113 | I/O — User I/O pin (bank 6) |
| Pin 114 | I/O — User I/O pin (bank 6) |
| Pin 115 | I/O — User I/O pin (bank 6) |
| Pin 116 | I/O — User I/O pin (bank 6) |
| Pin 117 | I/O — User I/O pin (bank 6) |
| Pin 118 | I/O — User I/O pin (bank 6) |
| Pin 119 | I/O — User I/O pin (bank 6) |
| Pin 120 | VCCIO6 — I/O bank 6 supply voltage |
| Pin 121 | I/O — User I/O pin (bank 6) |
| Pin 122 | I/O — User I/O pin (bank 6) |
| Pin 123 | I/O — User I/O pin (bank 6) |
| Pin 124 | I/O — User I/O pin (bank 6) |
| Pin 125 | GND — Ground |
| Pin 126 | I/O — User I/O pin (bank 6) |
| Pin 127 | I/O — User I/O pin (bank 6) |
| Pin 128 | I/O — User I/O pin (bank 6) |
| Pin 129 | I/O — User I/O pin (bank 6) |
| Pin 130 | I/O — User I/O pin (bank 6) |
| Pin 131 | nCONFIG — Configuration control (active-low reset) |
| Pin 132 | nSTATUS — Configuration status (active-low) |
| Pin 133 | CONF_DONE — Configuration done (open-drain) |
| Pin 134 | MSEL0 — Configuration mode select 0 |
| Pin 135 | MSEL1 — Configuration mode select 1 |
| Pin 136 | TCK — JTAG test clock |
| Pin 137 | TMS — JTAG test mode select |
| Pin 138 | TDI — JTAG test data in |
| Pin 139 | TDO — JTAG test data out |
| Pin 140 | CLK0 — Dedicated global clock input 0 |
| Pin 141 | CLK1 — Dedicated global clock input 1 |
| Pin 142 | CLK2/DATA0 — Dedicated clock / data input |
| Pin 143 | CLK3/DATA1 — Dedicated clock / data input |
| Pin 144 | GND — Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K50TI144-1X is suitable for 6 applications: Industrial Glue Logic Consolidation, Legacy Peripheral Bridge (UART/SPI/I2C), Pre-ASIC Prototyping Platform, Test and Measurement Front-End, Communication Protocol Consolidation, Legacy System Maintenance / EOL Replacement.
Industrial Glue Logic Consolidation
The EP1K50TI144-1X is widely used to consolidate 5 to 20 discrete 74-series TTL or HC logic chips onto a single programmable device in industrial control cabinets. With 50,000 equivalent gates and 2,880 logic elements, it provides enough capacity for complex state machines, address decoding, and bus steering logic, while its 102 user I/O pins support direct connection to many parallel peripherals. Industrial temperature grade (-40 C to +85 C) ensures reliable operation in factory floor enclosures where ambient temperatures can fluctuate widely. Compared to discrete logic, the FPGA reduces PCB area, lowers assembly cost, and enables late-stage design changes without board rework. Designers pair it with an EPC configuration ROM and a 2.5 V LDO regulator on a compact industrial backplane.
Recommended
Legacy Peripheral Bridge (UART/SPI/I2C)
Many factory automation and test systems use the EP1K50TI144-1X as a bridge between mismatched serial protocols (UART to SPI, I2C to parallel, RS-232 to RS-485). The FPGA's flexible I/O banks can interface with 2.5 V, 3.3 V, and 5 V peripherals in the same design, while the embedded array blocks (EABs) provide small FIFO buffers for protocol rate matching. Industrial temperature rating and the 144-pin TQFP's proven reliability make this part common in long-lifecycle equipment that must operate for 15+ years. The volatile SRAM configuration requires an EPC configuration ROM on the board, but the resulting design can be updated in the field by reprogramming the ROM.
Recommended
Pre-ASIC Prototyping Platform
Design teams use the EP1K50TI144-1X as a low-cost pre-ASIC prototype target because Quartus II synthesis results transfer cleanly to larger ACEX 1K devices or to Cyclone IV ASIC replacements. With 50K gates and 90 MHz Fmax at the -1 speed grade, the device validates DSP datapaths, embedded processor cores (Nios), and bus architectures before committing to a masked ASIC. The 144-pin TQFP is easy to hand-solder during early bring-up, and the industrial temperature grade allows prototype validation in harsh environments. Although the part is now obsolete, existing engineering inventory supports many legacy prototype platforms still in production use.
Recommended
Test and Measurement Front-End
Test equipment manufacturers integrate the EP1K50TI144-1X into bench instruments such as logic analyzers, protocol analyzers, and custom ATE platforms because its high I/O count and reconfigurable fabric allow one board to support multiple test personalities. The 102 user I/Os can fan out to multiple DUT connectors, while embedded array blocks implement capture buffers and trigger logic. The industrial temperature grade supports lab-to-floor deployment, and the 144-pin TQFP package is straightforward to assemble on multilayer test backplanes. Engineers write custom test personalities in VHDL or Verilog and recompile via Quartus II, dramatically shortening test-program development cycles.
Recommended
Communication Protocol Consolidation
Embedded networking equipment uses the EP1K50TI144-1X to consolidate custom packet processing, framing, and error-correction logic that would otherwise require multiple CPLDs and discrete FIFOs. The FPGA's EAB blocks implement small CAMs and lookup tables for protocol headers, while general logic handles CRC and framing. Multi-volt I/O support allows direct connection to 3.3 V PHYs and 5 V legacy buses. The industrial temperature range is critical for outdoor telecom and roadside cabinet installations where commercial-grade parts would fail.
Recommended
Legacy System Maintenance / EOL Replacement
Because the EP1K50TI144-1X is now obsolete, industrial customers with installed equipment use it primarily as a form-fit-function replacement board for legacy systems that cannot be redesigned. Authorized distributors, brokers (Octopart-listed vendors, Vemeko, Vyrian), and OEM surplus channels carry remaining stock. For new designs, Intel recommends migrating to MAX 10 (10M08SCE144) or Cyclone IV (EP4CE6E22C8N) in similar TQFP packages, which offer comparable or greater logic density, non-volatile configuration, and active toolchain support. Designers porting legacy ACEX 1K designs should plan a Quartus II to Quartus Prime migration path before committing to the modern replacement.
Recommended
Recommended Products Summary
Engineering reference data for EP1K50TI144-1X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K50TI144-2N | EP1K50TI144-3N | EP1K30TI144-2N | EP1K30TI144-3N | EP1C6T144C8N |
|---|---|---|---|---|---|---|
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | Cyclone |
| Equivalent Gates | 50,000 | 50,000 | 50,000 | 30,000 (-40%) | 30,000 (-40%) | [DATA_NEEDED: ~6,000 logic elements] |
| Logic Elements | 2,880 | 2,880 | 2,880 | 1,728 | 1,728 | 5,980 |
| Speed Grade | -1 (slowest) | -2 (medium) | -3 (fastest) | -2 (medium) | -3 (fastest) | -8 (Cyclone family) |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 98 |
| Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 1.5 V core |
| Configuration Method | Volatile SRAM (EPC ROM required) | Volatile SRAM | Volatile SRAM | Volatile SRAM | Volatile SRAM | Volatile SRAM (AS mode) |
| Toolchain | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) | Quartus II (active) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | NRND / Last time buy |
Key Differentiators
- Same die as EP1K50TI144-2N and -3N; only speed grade differs (vs EP1K50TI144-2N)
- Higher logic density than EP1K30TI144 family (vs EP1K30TI144-2N)
- Modern Cyclone alternative in same package (vs EP1C6T144C8N)
Design Notes
Estimated: The EP1K50TI144-1X core current at 90 MHz with typical utilization is approximately 100 mA from a 2.5 V rail. Provide at least three 0.1 uF ceramic decoupling capacitors near VCCINT pins (pins 21, 43, 66, 87, 109), plus one bulk 10 uF tantalum or ceramic capacitor. Each VCCIO bank (pins 7, 31, 54, 76, 98, 120) requires its own decoupling network sized for the I/O switching current. A linear LDO such as a 2.5 V regulator is acceptable for low-noise designs; for higher I/O switching loads, a switching regulator followed by an LDO provides better efficiency.
Route the JTAG chain (TCK, TMS, TDI, TDO) with impedance-controlled traces and keep them short (< 50 mm) to avoid signal integrity issues during in-system programming. Place the EPC configuration ROM within 50 mm of the FPGA's DATA/DCLK pins to meet ACEX 1K configuration timing. Provide a 1 kohm pull-up on nCONFIG and a 10 kohm pull-up on CONF_DONE per the Altera reference design. Decoupling capacitors must be placed as close as possible to the corresponding power pins to minimize supply inductance.
Do not leave MSEL0/MSEL1 floating; tie them to VCCINT or GND to select the correct configuration mode (typically AS mode for EPC1/EPC2). Ensure the EPC configuration ROM is correctly programmed before solder reflow because the ACEX 1K will not boot without valid configuration data. Verify that all VCCIO banks are powered even if unused, otherwise the FPGA's I/O pins enter indeterminate states. When migrating designs between speed grades, re-run Quartus II timing analysis because the -1, -2, and -3 grades have different Fmax and tCO specifications.
Estimated: At typical utilization (50% logic, 50% I/O toggling at 50 MHz) the EP1K50TI144-1X dissipates approximately 0.5 W, well within the TQFP-144's thermal envelope without a heatsink. Under worst-case utilization (100% logic at 90 MHz), dissipation can reach 1.0 to 1.5 W; in enclosed industrial enclosures with minimal airflow, attach a small clip-on heatsink or provide thermal vias under the package thermal pad. Industrial temperature grade (-40 C to +85 C) ensures reliable operation but does not substitute for proper thermal management.
Compliance Information
RoHS, REACH, AEC-Q100, lead-free, halogen-free, and conflict-mineral status were not present in the verified distributor data. ACEX 1K parts are obsolete and predate modern compliance documentation standards; verify compliance with your supplier at the time of order.
