EP1S25F672C6 vs EP1S25F672C5N Comparison

Detailed side-by-side comparison of EP1S25F672C6 by Intel and EP1S25F672C5N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP1S25F672C6 EP1S25F672C6 - Stratix FPGA 25,660 LE | Intel | BGA-672

EP1S25F672C6 - Stratix FPGA 25,660 LE | Intel | BGA-672

EP1S25F672C6 ⚠ Last Time Buy

Specification Comparison

Parameter EP1S25F672C6 EP1S25F672C5N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $125.00 $142.00
Family Stratix Stratix
Logic Elements 25,660 —
Configurable Logic Blocks (CLBs) 2,852 —
Total RAM Bits 1,944,576 —
DSP Blocks 14 —
Maximum User I/O 473 —
Package 672-BBGA (FineLine BGA, 35 x 35 mm, 1.27 mm pitch) —
Core Voltage 1.5 V —
Process Technology 130 nm CMOS 130 nm CMOS
Operating Temperature 0C to +85C (Commercial) —
Logic Family CMOS —
Speed Grade 6 C5
Configuration Method JTAG, Passive Serial, Fast Passive Parallel, Active Serial SRAM-based, programmable via JTAG / Passive Serial / Fast Passive Parallel
Mounting Type Surface Mount Surface Mount (BGA)
RoHS Status Compliant Compliant
PLL Count (Maximum) 12 (including enhanced PLLs) —
Series — EP1S25
Logic Elements (Cells) — 25,660
Number of CLBs — 2,566
Number of Logic Cells / Gates — [DATA_NEEDED: total system gates]
Maximum Internal Frequency — 500 MHz
Core Supply Voltage — 1.5 V (nominal)
Number of I/O Pins — 473 user I/O
Number of I/O Banks — [DATA_NEEDED: I/O bank count]
Package Type — FineLine BGA (FBGA)
Package Pin Count — 672
Ball Pitch — 1.00 mm
Operating Temperature Range — 0 °C to +85 °C (commercial)
Lead-Free (Pb-Free) — Yes (suffix "N")

Datasheets & Resources

Browse All Products Create BOM Request Quote