EP1S25F672C6 vs EP1S25F672C5N Vergleich

Detaillierter Direktvergleich von EP1S25F672C6 von Intel und EP1S25F672C5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP1S25F672C6 EP1S25F672C6 - Stratix FPGA 25,660 LE | Intel | BGA-672

EP1S25F672C6 - Stratix FPGA 25,660 LE | Intel | BGA-672

EP1S25F672C6 ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP1S25F672C6 EP1S25F672C5N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Letzte Kaufgelegenheit Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $125,00 $142,00
Family Stratix Stratix
Logic Elements 25,660 —
Configurable Logic Blocks (CLBs) 2,852 —
Total RAM Bits 1,944,576 —
DSP Blocks 14 —
Maximum User I/O 473 —
Gehäuse 672-BBGA (FineLine BGA, 35 x 35 mm, 1.27 mm pitch) —
Core Voltage 1.5 V —
Process Technology 130 nm CMOS 130 nm CMOS
Betriebstemperatur 0C to +85C (Commercial) —
Logic Family CMOS —
Speed Grade 6 C5
Configuration Method JTAG, Passive Serial, Fast Passive Parallel, Active Serial SRAM-based, programmable via JTAG / Passive Serial / Fast Passive Parallel
Montageart Surface Mount Surface Mount (BGA)
RoHS-Status Compliant Compliant
PLL Count (Maximum) 12 (including enhanced PLLs) —
Series — EP1S25
Logic Elements (Cells) — 25,660
Number of CLBs — 2,566
Number of Logic Cells / Gates — [DATA_NEEDED: total system gates]
Maximum Internal Frequency — 500 MHz
Core Supply Voltage — 1.5 V (nominal)
Number of I/O Pins — 473 user I/O
Number of I/O Banks — [DATA_NEEDED: I/O bank count]
Package Type — FineLine BGA (FBGA)
Package Pin Count — 672
Ball Pitch — 1.00 mm
Betriebstemperaturbereich — 0 °C to +85 °C (commercial)
Lead-Free (Pb-Free) — Yes (suffix "N")

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