EP1S25F672C6 - Stratix FPGA 25,660 LE | Intel | BGA-672
MPN: EP1S25F672C6 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168.5 | $1,685.00 |
| 100 | $152 | $15,200.00 |
| 500 | $138 | $69,000.00 |
| 1,000 | $125 | $125,000.00 |
Drop-in alternatives for EP1S25F672C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S25F672C6N
✅ Drop-In✓ In Stock
$192.75 / Unit
View Datasheet →EP1S25F672C7N
✅ Drop-In✓ In Stock
$535 / Unit
View Datasheet →EP1S25F672C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$142 / Unit
View Datasheet →EP1S25B672C6
✅ Drop-In✓ In Stock
$990 / Unit
View Datasheet →EP1S25B672C6N
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$198 / Unit
View Datasheet →EP1S20F672C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$470 / Unit
View Datasheet →EP1S25F672C6 Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,852 |
| Total RAM Bits | 1,944,576 |
| DSP Blocks | 14 |
| Maximum User I/O | 473 |
| Package | 672-BBGA (FineLine BGA, 35 x 35 mm, 1.27 mm pitch) |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Operating Temperature | 0C to +85C (Commercial) |
| Logic Family | CMOS |
| Speed Grade | 6 |
| Configuration Method | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| PLL Count (Maximum) | 12 (including enhanced PLLs) |
EP1S25F672C6 672-bbga (fineline bga, 35 x 35 mm, 1.27 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S25F672C6 (672-bbga (fineline bga, 35 x 35 mm, 1.27 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S25F672C6.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S25F672C6 is suitable for 6 applications: Wireless Base Station Baseband Processing, High-Speed Data Acquisition Cards, Software Defined Radio (SDR) Platforms, Medical Imaging Pipeline (Ultrasound / CT), Industrial Machine Vision Inspection, Protocol Bridging and Custom Interface Aggregation.
Wireless Base Station Baseband Processing
The EP1S25F672C6 fits wireless base station baseband processing because its 25,660 logic elements, 14 dedicated DSP blocks, and 1,944,576 RAM bits provide the computational headroom needed for multi-carrier modulation, channel coding, and FFT/iFFT operations on 3G/4G baseband datapaths. The Stratix DSP blocks implement 9x9, 18x18, and 36x36 multipliers with full precision, allowing a single block to handle complex multiplications used in QAM demodulation. Its 12 PLLs support multiple reference clocks for radio card synchronization to GPS or backhaul network references. Designers typically instantiate multiple MAC (Medium Access Control) channels, Turbo or Viterbi decoders, and uplink scrambling functions in parallel, with on-chip TriMatrix memory used for soft-decision buffers and interleaver tables.
Recommended
High-Speed Data Acquisition Cards
For high-speed data acquisition cards, the EP1S25F672C6's combination of 473 user I/O, abundant TriMatrix memory (up to 256 Kbytes across M512/M4K/M-RAM blocks), and parallel DSP throughput enables multi-channel ADC capture with on-chip pre-processing. The MultiVolt I/O supports direct interfacing to 1.5V, 1.8V, 2.5V, and 3.3V ADCs without level translators, reducing board complexity and BOM. Designers can implement FIR decimation filters, channel calibration, and trigger logic in fabric, while storing pre-trigger samples in on-chip M4K blocks. The 1.5V core and 130nm CMOS process yield static power levels compatible with PCI/PCIe card thermal envelopes. Typical deployment: 8-channel 14-bit 125 MSPS ADC arrays feeding LVDS pairs into the FPGA for digital down-conversion.
Recommended
Software Defined Radio (SDR) Platforms
The EP1S25F672C6 is well suited to software defined radio platforms because its DSP block count (14), logic density, and abundant memory enable real-time DDC (digital down-conversion), DUC (digital up-conversion), and arbitrary waveform modulation across wide bandwidths. SDR implementations partition signal processing into baseband sampling, channelization, and demodulation stages; the Stratix's TriMatrix memory acts as sample-rate conversion buffers and FFT twiddle-factor storage. The 12 PLLs allow independent sample-rate domains for ADC and DAC paths plus an LO reference. Combined with an external ADC such as the AD9862 or DAC5687, the EP1S25F672C6 implements complete SDR transceivers for tactical radio, public safety, and academic research platforms operating from HF through C-band IF frequencies.
Recommended
Medical Imaging Pipeline (Ultrasound / CT)
The EP1S25F672C6 supports medical imaging pipelines in ultrasound and CT modalities where beamforming, image reconstruction, and real-time filtering demand high logic density combined with deterministic throughput. In ultrasound, multiple transducer channels (64-256) are beamformed in parallel using the FPGA's DSP blocks to compute delay-and-sum across each scanline at kHz rates; the abundant M4K memory holds channel sample histories while M-RAM stores beamformed line buffers before scan conversion. The 473 user I/O pins interface to multi-channel ADC front-ends such as the AD9271 ultrasound AFE without multiplexing. IEC 60601-1 medical safety compliance is achieved at the system level; the FPGA itself operates reliably within the 0-85C commercial range inside a temperature-controlled chassis.
Recommended
Industrial Machine Vision Inspection
The EP1S25F672C6 enables industrial machine vision systems by providing parallel image processing for line-scan and area-scan cameras running at 100-500 MHz pixel rates. Its 14 DSP blocks accelerate Sobel, Laplacian, and convolution kernels used for edge detection and defect identification, while the TriMatrix memory buffers full-frame images at GigE Vision or Camera Link rates. The MultiVolt I/O interfaces directly to Camera Link receivers and LVDS image sensors without external translators. Machine vision deployments commonly chain FPGA preprocessing (filtering, thresholding, blob analysis) with a host CPU for classification; the Stratix acts as a deterministic preprocessor, reducing host CPU load and increasing inspection throughput on factory lines running at 60+ parts per minute.
Recommended
Protocol Bridging and Custom Interface Aggregation
The EP1S25F672C6 is widely used in protocol bridging applications where multiple standard interfaces (PCI, PCI-X, RapidIO, Utopia, SPI, I2C, UART) must be aggregated, rate-matched, and forwarded to a host processor or ASIC. Its 473 user I/O and 12 PLLs allow simultaneous operation of multiple clock domains - critical for bridging asynchronous protocols like SATA (via external PHY) to a system backplane running at a different reference clock. The TriMatrix memory provides shared FIFOs for cross-clock-domain buffering, while the logic density accommodates custom state machines and DMA engines. Networking OEMs and storage system builders used the original Stratix for top-of-rack switches, storage controllers, and custom telecom line cards in the 2005-2010 timeframe.
Recommended
Recommended Products Summary
Engineering reference data for EP1S25F672C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S25F672C6N | EP1S25F672C7N | EP1S25F672C5N | EP1S25B672C6 | EP1S20F672C6 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BBGA (FineLine BGA, 35 x 35 mm, 1.27 mm pitch) | 672-BBGA (FineLine BGA, 35 x 35 mm) - same | 672-BBGA (FineLine BGA, 35 x 35 mm) - same | 672-BBGA (FineLine BGA, 35 x 35 mm) - same | 672-BBGA (FineLine BGA, 35 x 35 mm) - same | 672-BBGA (FineLine BGA, 35 x 35 mm) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 (with transceivers) | 18,460 (-28%) |
| Speed Grade | 6 | 6 | 7 (15-20% faster) | 5 (slower, lower cost) | 6 | 6 |
| Lead-Free | No (standard SnPb BGA) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | No | No |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,669,248 (-14%) |
| DSP Blocks | 14 | 14 | 14 | 14 | 14 | 10 (-29%) |
| Embedded Transceivers | No | No | No | No | Yes (3.125 Gbps) | No |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Lead-free BGA variant for RoHS-regulated markets (vs EP1S25F672C6 (standard SnPb BGA))
- Embedded 3.125 Gbps transceivers for serial I/O (vs EP1S25F672C6 (standard Stratix without transceivers))
- Higher density logic for larger designs (vs EP1S20F672C6 (Stratix with 18,460 LEs))
- Faster speed grade for timing-critical paths (vs EP1S25F672C5N (speed grade 5))
Design Notes
Estimated: The 672-ball FineLine BGA at 1.27 mm pitch requires at least a 6-layer PCB with stacked microvia or via-in-pad construction to escape inner rows. Per Stratix Hardware Reference Manual, provide at least two dedicated ground planes and one 1.5V core power plane; place 4-8 0.1uF X7R ceramic decoupling capacitors in the proximity of each VCC pin group. Matched-impedance length tuning is required for LVDS pairs and clock nets.
Estimated: At full logic utilization (~25,660 LEs switching at 200 MHz toggle rate) the EP1S25F672C6 dissipates approximately 2.5-4 W internally depending on clock tree usage. The 35 x 35 mm BGA package provides a thermal resistance theta_JA of approximately 8-12 C/W with a 1 oz copper ground plane and adequate airflow (200 LFM). Designers should include thermal vias under the central BGA balls for heat extraction; a heatsink is optional at moderate utilization but recommended for closed chassis deployments.
Allocate dedicated configuration pins (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE, MSEL0/1/2, DCLK) on a separate PCB header or JTAG chain to enable in-system re-programming via the Quartus II Programmer. Route configuration signals away from switching I/O to minimize crosstalk during power-up. Place the configuration PROM (EPCS16 or EPC2) within 2 inches of the FPGA with matched-length traces. Use Altera's AN 161 configuration guidelines for robust multi-device JTAG chains and parallel configuration topologies.
Estimated: Common pitfalls with EP1S25F672C6 designs include: (1) failing to assign all VCC and GND pins (all 672 balls must be connected; floating power pins cause partial programming and JTAG failures); (2) violating the 1.5V core power-up ramp time (must reach 1.5V within 100 ms with monotonic ramp per Stratix hot-socketing spec); (3) driving LVTTL 3.3V signals into LVCMOS 1.5V I/O banks without configuring MultiVolt I/O standards; (4) ignoring the nCE (chip enable) chain when multiple FPGAs share a configuration bus. Always run the Quartus II power analyzer and pin planner validation before PCB fabrication.
Compliance Information
Standard EP1S25F672C6 uses SnPb BGA finish (not lead-free). For RoHS compliance use EP1S25F672C6N variant. AEC-Q100 not applicable for commercial-grade FPGA. Compliance values not explicitly stated in provided web data - marked unknown where not extractable.
