EP20K100QC240-1XV vs EP20K100QC240-3N Comparison
Detailed side-by-side comparison of EP20K100QC240-1XV by Intel and EP20K100QC240-3N by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP20K100QC240-1XV - APEX 20K 100K-Gate FPGA, 240-PQFP | Intel / Altera
EP20K100QC240-1XV ObsoleteSpecification Comparison
| Parameter | EP20K100QC240-1XV | EP20K100QC240-3N |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $52.10 | $0.00 |
| Series | APEX 20K | β |
| Device Family | APEX 20K (MultiCore architecture) | β |
| System Gates | 100,000 gates | β |
| Logic Elements (Cells) | 4,160 | β |
| Embedded Memory | 53,248 bits | β |
| User I/Os | 189 | β |
| Dedicated Inputs | 4 | β |
| PLLs | 4 | β |
| Core Supply Voltage (VCCINT) | 2.5 V nominal (2.375 V to 2.625 V) | β |
| I/O Supply Voltage (VCCIO) | 3.3 V / 5 V tolerant | β |
| Propagation Delay (tpd) | 2.5 ns | β |
| Maximum Internal Frequency | 250 MHz | β |
| Process Technology | 0.22 um CMOS | β |
| Package | 240-pin PQFP (32 x 32 mm, 0.5 mm pitch) | 240-BFQFP |
| Mounting Type | Surface Mount (gull-wing leads) | Surface Mount |
| Operating Temperature | 0C to +85C (commercial) / -40C to +85C (industrial variant) | 0 C to 85 C |
| Configuration Interface | JTAG / serial (EPC configuration device) | β |
| RoHS Status | Non-compliant (legacy PQFP, non-LEAD-FREE process) | unknown |
| Lifecycle Status | Obsolete / last-time-buy per Altera PCN | β |
| Device Type | β | FPGA |
| Family | β | APEX-20K |
| Gate Count | β | 100000 gates |
| Logic Cells | β | 4160 cells |
| User I/O | β | 189 I/O |
| Distributed Memory | β | 53248 bits |
| Macrocells | β | 416 macrocells |
| Supply Voltage | β | 2.375 V to 2.625 V |
| Nominal Supply | β | 2.5 V |
| Maximum Frequency | β | 167 MHz |
| Pin Count | β | 240 pins |
| Fabrication Process | β | 0.15 um all-layer copper-metal process |
| Package Pitch | β | 1.27 mm |
| Package Dimensions | β | 45 mm x 45 mm |
| AEC-Q100 | β | not_qualified |