EP20K100QC240-1XV vs EP20K100QC240-3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP20K100QC240-1XV disebabkan oleh Intel dan EP20K100QC240-3N disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP20K100QC240-1XV - APEX 20K 100K-Gate FPGA, 240-PQFP | Intel / Altera
EP20K100QC240-1XV ObsoletePengandingan Spesifikasi
| Parametr | EP20K100QC240-1XV | EP20K100QC240-3N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Aktif |
| Series | APEX 20K | — |
| Device Family | APEX 20K (MultiCore architecture) | — |
| System Gates | 100,000 gates | — |
| Logic Elements (Cells) | 4,160 | — |
| Embedded Memory | 53,248 bits | — |
| User I/Os | 189 | — |
| Dedicated Inputs | 4 | — |
| PLLs | 4 | — |
| Core Supply Voltage (VCCINT) | 2.5 V nominal (2.375 V to 2.625 V) | — |
| I/O Supply Voltage (VCCIO) | 3.3 V / 5 V tolerant | — |
| Propagation Delay (tpd) | 2.5 ns | — |
| Maximum Internal Frequency | 250 MHz | — |
| Process Technology | 0.22 um CMOS | — |
| Kemasan | 240-pin PQFP (32 x 32 mm, 0.5 mm pitch) | 240-BFQFP |
| Jenis Pemasangan | Surface Mount (gull-wing leads) | Surface Mount |
| Suhu Operasi | 0C to +85C (commercial) / -40C to +85C (industrial variant) | 0 C to 85 C |
| Configuration Interface | JTAG / serial (EPC configuration device) | — |
| Status RoHS | Non-compliant (legacy PQFP, non-LEAD-FREE process) | unknown |
| Status Lingkungan Hidup | Obsolete / last-time-buy per Altera PCN | — |
| Device Type | — | FPGA |
| Family | — | APEX-20K |
| Gate Count | — | 100000 gates |
| Logic Cells | — | 4160 cells |
| User I/O | — | 189 I/O |
| Distributed Memory | — | 53248 bits |
| Macrocells | — | 416 macrocells |
| Tegangan Pemberi Arus | — | 2.375 V to 2.625 V |
| Nominal Supply | — | 2.5 V |
| Maximum Frequency | — | 167 MHz |
| Kiraan Pin | — | 240 pins |
| Fabrication Process | — | 0.15 um all-layer copper-metal process |
| Package Pitch | — | 1.27 mm |
| Package Dimensions | — | 45 mm x 45 mm |
| AEC-Q100 | — | not_qualified |