EP20K600CF672C8N vs EP20K600CF672C9N Perbandingan
Perbandingan bersamaan detil EP20K600CF672C8N dari Intel dan EP20K600CF672C9N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP20K600CF672C8N | EP20K600CF672C9N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Device Type | SPLD | Loadable PLD / SRAM FPGA |
| Product Type | FPGA / programmable logic device | — |
| Family | APEX 20KC | APEX 20KC |
| Nominal Gate Capacity | 600K gates | — |
| Logic Elements or Cells | 24,320 | — |
| Macros | 2,432 | — |
| User I/O Count | 508 | — |
| Package Terminals | 652 pins | — |
| Paket | BGA-652, 45 x 45 mm, 1.27 mm pitch | — |
| Package Description | 672-pin FC-FBGA | — |
| Tegangan Pemuat | 1.8 V | — |
| Listed Frequency | 301.21 MHz | — |
| Propagation Delay | 1.48 ns | 1.48 ns (per logic element) |
| Fabrication Process | 0.15 µm | — |
| Suhu Kerja | 0°C to 85°C | 0 C to 85 C (commercial) |
| Interconnect Metal | All-layer copper metal | — |
| I/O Configuration | 508 user I/O | — |
| Tipe Mounting | Surface mount | Surface Mount |
| Status RoHS | unknown | [DATA_NEEDED: RoHS status] |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Configuration Method | [DATA_NEEDED: configuration memory and programming method] | — |
| Core Current | [DATA_NEEDED: core supply current] | — |
| I/O Bank Voltage | [DATA_NEEDED: supported I/O voltage range] | — |
| Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Tahanan Panas | [DATA_NEEDED: junction-to-ambient thermal resistance] | — |
| System Gates | — | 600,000 |
| Logic Elements | — | 24,320 |
| Maximum Operating Frequency | — | 250 MHz |
| Core Supply Voltage | — | 1.71 V to 1.89 V (1.8 V nominal) |
| User I/Os | — | 488 |
| Total Terminals | — | 672 |
| Package Type | — | FineLine BGA (FC-FBGA), 1.00 mm pitch, 45 x 45 mm |
| Process Technology | — | 0.15 µm all-layer copper |
| Configuration Interface | — | JTAG (IEEE 1149.1), passive serial, active serial |
| Embedded Memory | — | MultiCore EABs supporting up to 311,000 RAM bits |