EP20K600CF672C8N vs EP20K600CF672C9N مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP20K600CF672C8N بواسطة Intel و EP20K600CF672C9N بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP20K600CF672C8N | EP20K600CF672C9N |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | Obsolete |
| Device Type | SPLD | Loadable PLD / SRAM FPGA |
| Product Type | FPGA / programmable logic device | — |
| Family | APEX 20KC | APEX 20KC |
| Nominal Gate Capacity | 600K gates | — |
| Logic Elements or Cells | 24,320 | — |
| Macros | 2,432 | — |
| User I/O Count | 508 | — |
| Package Terminals | 652 pins | — |
| العلبة | BGA-652, 45 x 45 mm, 1.27 mm pitch | — |
| Package Description | 672-pin FC-FBGA | — |
| جهد التغذية | 1.8 V | — |
| Listed Frequency | 301.21 MHz | — |
| Propagation Delay | 1.48 ns | 1.48 ns (per logic element) |
| Fabrication Process | 0.15 µm | — |
| درجة حرارة التشغيل | 0°C to 85°C | 0 C to 85 C (commercial) |
| Interconnect Metal | All-layer copper metal | — |
| I/O Configuration | 508 user I/O | — |
| نوع التركيب | Surface mount | Surface Mount |
| حالة RoHS | unknown | [DATA_NEEDED: RoHS status] |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Configuration Method | [DATA_NEEDED: configuration memory and programming method] | — |
| Core Current | [DATA_NEEDED: core supply current] | — |
| I/O Bank Voltage | [DATA_NEEDED: supported I/O voltage range] | — |
| Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| المقاومة الحرارية | [DATA_NEEDED: junction-to-ambient thermal resistance] | — |
| System Gates | — | 600,000 |
| Logic Elements | — | 24,320 |
| Maximum Operating Frequency | — | 250 MHz |
| Core Supply Voltage | — | 1.71 V to 1.89 V (1.8 V nominal) |
| User I/Os | — | 488 |
| Total Terminals | — | 672 |
| Package Type | — | FineLine BGA (FC-FBGA), 1.00 mm pitch, 45 x 45 mm |
| Process Technology | — | 0.15 µm all-layer copper |
| Configuration Interface | — | JTAG (IEEE 1149.1), passive serial, active serial |
| Embedded Memory | — | MultiCore EABs supporting up to 311,000 RAM bits |