EP2AGX45DF29C4N vs EP2AGX45DF29I3NAD Comparison

Detailed side-by-side comparison of EP2AGX45DF29C4N by Intel and EP2AGX45DF29I3NAD by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP2AGX45DF29I3NAD EP2AGX45DF29I3NAD - 42K LE Arria II GX FPGA 780-FBGA | Intel

EP2AGX45DF29I3NAD - 42K LE Arria II GX FPGA 780-FBGA | Intel

EP2AGX45DF29I3NAD βœ“ Active

Specification Comparison

Parameter EP2AGX45DF29C4N EP2AGX45DF29I3NAD
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $335.45 $285.10
Series Arria II GX β€”
Device Family Arria II GX FPGA β€”
Logic Elements (LE) 42,959 β€”
Number of LABs 1805 β€”
Embedded Memory (Bits) 3,517,440 β€”
M9K Memory Blocks 1541 Kbits β€”
MLAB Memory 656 Kbits (configurable as LEs) β€”
DSP Blocks (18x18 Multipliers) 232 β€”
Number of Transceivers 8 channels β€”
Transceiver Data Rate Up to 6.375 Gbps 600 Mbps to 6.375 Gbps
Maximum User I/O 364 β€”
PLL Count 8 (4 enhanced + 4 fast) β€”
Global Clock Networks Up to 16 β€”
Process Technology 40 nm TSMC β€”
Core Voltage (VCC) 1.1 V β€”
Auxiliary Supply (VCCPT) 0.9 V β€”
Speed Grade C4 (commercial, mid-speed) I3 (industrial, -40C to +100C junction, fastest speed bin in the I grade)
Temperature Range 0C to +85C (commercial) β€”
Package 780-ball FBGA (FineLine BGA, 29x29 mm) 780-ball FBGA (FineLine BGA)
Mounting Type Surface Mount Surface Mount
MSL Level 3 β€”
RoHS Status Compliant [DATA_NEEDED: rohs status]
Lead-Free Yes β€”
Family β€” Arria II GX
Logic Elements β€” 42,959
Logic Array Blocks (LABs) β€” 1,805
Embedded RAM Bits β€” 3,517,440
User I/Os β€” 364
Process Node β€” 40 nm
Transceivers β€” Multi-gigabit transceivers integrated
Multipliers (18x18) β€” 156 (typical)
Temperature Grade β€” Industrial (I)
Core Voltage β€” [DATA_NEEDED: VCCINT typical value]

Datasheets & Resources

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