EP2AGX45DF29C4N vs EP2AGX45DF29I3NAD Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGX45DF29C4N disebabkan oleh Intel dan EP2AGX45DF29I3NAD disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGX45DF29C4N | EP2AGX45DF29I3NAD |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria II GX | — |
| Device Family | Arria II GX FPGA | — |
| Logic Elements (LE) | 42,959 | — |
| Number of LABs | 1805 | — |
| Embedded Memory (Bits) | 3,517,440 | — |
| M9K Memory Blocks | 1541 Kbits | — |
| MLAB Memory | 656 Kbits (configurable as LEs) | — |
| DSP Blocks (18x18 Multipliers) | 232 | — |
| Number of Transceivers | 8 channels | — |
| Transceiver Data Rate | Up to 6.375 Gbps | 600 Mbps to 6.375 Gbps |
| Maximum User I/O | 364 | — |
| PLL Count | 8 (4 enhanced + 4 fast) | — |
| Global Clock Networks | Up to 16 | — |
| Process Technology | 40 nm TSMC | — |
| Core Voltage (VCC) | 1.1 V | — |
| Auxiliary Supply (VCCPT) | 0.9 V | — |
| Speed Grade | C4 (commercial, mid-speed) | I3 (industrial, -40C to +100C junction, fastest speed bin in the I grade) |
| Temperature Range | 0C to +85C (commercial) | — |
| Kemasan | 780-ball FBGA (FineLine BGA, 29x29 mm) | 780-ball FBGA (FineLine BGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Aras MSL | 3 | — |
| Status RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Lead-Free | Yes | — |
| Family | — | Arria II GX |
| Logic Elements | — | 42,959 |
| Logic Array Blocks (LABs) | — | 1,805 |
| Embedded RAM Bits | — | 3,517,440 |
| User I/Os | — | 364 |
| Process Node | — | 40 nm |
| Transceivers | — | Multi-gigabit transceivers integrated |
| Multipliers (18x18) | — | 156 (typical) |
| Temperature Grade | — | Industrial (I) |
| Core Voltage | — | [DATA_NEEDED: VCCINT typical value] |