EP2AGX45DF29C4N vs EP2AGX45DF29I3NAD 比較
詳細並排比較 EP2AGX45DF29C4N 由 Intel 與 EP2AGX45DF29I3NAD 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2AGX45DF29C4N | EP2AGX45DF29I3NAD |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Series | Arria II GX | — |
| Device Family | Arria II GX FPGA | — |
| Logic Elements (LE) | 42,959 | — |
| Number of LABs | 1805 | — |
| Embedded Memory (Bits) | 3,517,440 | — |
| M9K Memory Blocks | 1541 Kbits | — |
| MLAB Memory | 656 Kbits (configurable as LEs) | — |
| DSP Blocks (18x18 Multipliers) | 232 | — |
| Number of Transceivers | 8 channels | — |
| Transceiver Data Rate | Up to 6.375 Gbps | 600 Mbps to 6.375 Gbps |
| Maximum User I/O | 364 | — |
| PLL Count | 8 (4 enhanced + 4 fast) | — |
| Global Clock Networks | Up to 16 | — |
| Process Technology | 40 nm TSMC | — |
| Core Voltage (VCC) | 1.1 V | — |
| Auxiliary Supply (VCCPT) | 0.9 V | — |
| Speed Grade | C4 (commercial, mid-speed) | I3 (industrial, -40C to +100C junction, fastest speed bin in the I grade) |
| Temperature Range | 0C to +85C (commercial) | — |
| 封裝 | 780-ball FBGA (FineLine BGA, 29x29 mm) | 780-ball FBGA (FineLine BGA) |
| 安裝類型 | Surface Mount | Surface Mount |
| MSL 等級 | 3 | — |
| RoHS 狀態 | Compliant | [DATA_NEEDED: rohs status] |
| Lead-Free | Yes | — |
| Family | — | Arria II GX |
| Logic Elements | — | 42,959 |
| Logic Array Blocks (LABs) | — | 1,805 |
| Embedded RAM Bits | — | 3,517,440 |
| User I/Os | — | 364 |
| Process Node | — | 40 nm |
| Transceivers | — | Multi-gigabit transceivers integrated |
| Multipliers (18x18) | — | 156 (typical) |
| Temperature Grade | — | Industrial (I) |
| Core Voltage | — | [DATA_NEEDED: VCCINT typical value] |