EP2AGX45DF29C4N vs EP2AGX45DF29I3NAD Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP2AGX45DF29C4N tarafından Intel ve EP2AGX45DF29I3NAD tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | EP2AGX45DF29C4N | EP2AGX45DF29I3NAD |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Series | Arria II GX | — |
| Device Family | Arria II GX FPGA | — |
| Logic Elements (LE) | 42,959 | — |
| Number of LABs | 1805 | — |
| Embedded Memory (Bits) | 3,517,440 | — |
| M9K Memory Blocks | 1541 Kbits | — |
| MLAB Memory | 656 Kbits (configurable as LEs) | — |
| DSP Blocks (18x18 Multipliers) | 232 | — |
| Number of Transceivers | 8 channels | — |
| Transceiver Data Rate | Up to 6.375 Gbps | 600 Mbps to 6.375 Gbps |
| Maximum User I/O | 364 | — |
| PLL Count | 8 (4 enhanced + 4 fast) | — |
| Global Clock Networks | Up to 16 | — |
| Process Technology | 40 nm TSMC | — |
| Core Voltage (VCC) | 1.1 V | — |
| Auxiliary Supply (VCCPT) | 0.9 V | — |
| Speed Grade | C4 (commercial, mid-speed) | I3 (industrial, -40C to +100C junction, fastest speed bin in the I grade) |
| Temperature Range | 0C to +85C (commercial) | — |
| Paket | 780-ball FBGA (FineLine BGA, 29x29 mm) | 780-ball FBGA (FineLine BGA) |
| Montaj Türü | Surface Mount | Surface Mount |
| MSL Seviyesi | 3 | — |
| RoHS Durumu | Compliant | [DATA_NEEDED: rohs status] |
| Lead-Free | Yes | — |
| Family | — | Arria II GX |
| Logic Elements | — | 42,959 |
| Logic Array Blocks (LABs) | — | 1,805 |
| Embedded RAM Bits | — | 3,517,440 |
| User I/Os | — | 364 |
| Process Node | — | 40 nm |
| Transceivers | — | Multi-gigabit transceivers integrated |
| Multipliers (18x18) | — | 156 (typical) |
| Temperature Grade | — | Industrial (I) |
| Core Voltage | — | [DATA_NEEDED: VCCINT typical value] |