EP2AGX45DF29C4N vs EP2AGX45DF29I3NAD तुलना
विस्तृत दोनों ओर की तुलना EP2AGX45DF29C4N द्वारा Intel और EP2AGX45DF29I3NAD द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2AGX45DF29C4N | EP2AGX45DF29I3NAD |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Series | Arria II GX | — |
| Device Family | Arria II GX FPGA | — |
| Logic Elements (LE) | 42,959 | — |
| Number of LABs | 1805 | — |
| Embedded Memory (Bits) | 3,517,440 | — |
| M9K Memory Blocks | 1541 Kbits | — |
| MLAB Memory | 656 Kbits (configurable as LEs) | — |
| DSP Blocks (18x18 Multipliers) | 232 | — |
| Number of Transceivers | 8 channels | — |
| Transceiver Data Rate | Up to 6.375 Gbps | 600 Mbps to 6.375 Gbps |
| Maximum User I/O | 364 | — |
| PLL Count | 8 (4 enhanced + 4 fast) | — |
| Global Clock Networks | Up to 16 | — |
| Process Technology | 40 nm TSMC | — |
| Core Voltage (VCC) | 1.1 V | — |
| Auxiliary Supply (VCCPT) | 0.9 V | — |
| Speed Grade | C4 (commercial, mid-speed) | I3 (industrial, -40C to +100C junction, fastest speed bin in the I grade) |
| Temperature Range | 0C to +85C (commercial) | — |
| पैकेज | 780-ball FBGA (FineLine BGA, 29x29 mm) | 780-ball FBGA (FineLine BGA) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| MSL स्तर | 3 | — |
| RoHS स्थिति | Compliant | [DATA_NEEDED: rohs status] |
| Lead-Free | Yes | — |
| Family | — | Arria II GX |
| Logic Elements | — | 42,959 |
| Logic Array Blocks (LABs) | — | 1,805 |
| Embedded RAM Bits | — | 3,517,440 |
| User I/Os | — | 364 |
| Process Node | — | 40 nm |
| Transceivers | — | Multi-gigabit transceivers integrated |
| Multipliers (18x18) | — | 156 (typical) |
| Temperature Grade | — | Industrial (I) |
| Core Voltage | — | [DATA_NEEDED: VCCINT typical value] |