EP2AGX95EF35C6 vs EP2AGX95EF35I3G Comparison

Detailed side-by-side comparison of EP2AGX95EF35C6 by Intel and EP2AGX95EF35I3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2AGX95EF35C6 EP2AGX95EF35I3G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $398.00 $280.00
Device Family Arria II GX β€”
Logic Elements (LEs) 89,178 β€”
Maximum User I/O Pins 452 β€”
Embedded Memory (Kbits) 4,478 β€”
Embedded 18x18 Multipliers 612 β€”
Number of Transceivers 8 β€”
Maximum Transceiver Data Rate 3.75 Gbps β€”
Package 1152-ball FCBGA 1152-BBGA, FCBGA
Speed Grade -6 (mid) β€”
Process Node 40 nm β€”
PCIe Hard IP PCIe Gen1/Gen2 (x1/x4/x8) - per family datasheet β€”
Operating Temperature Range Commercial (0C to 85C) per 'C' suffix β€”
Configuration Modes Active Serial, Passive Serial, Fast Passive Parallel, JTAG β€”
Mounting Type Surface Mount (FCBGA) Surface Mount
RoHS Status Compliant Compliant
Series β€” Arria II GX
Logic Elements β€” 89,178
Total RAM Bits β€” 6,839,296
Number of LABs/CLBs β€” 452
User I/O Count β€” 452
Operating Temperature β€” -40C to +100C (Industrial)
Supply Voltage β€” 0.9 V core, 1.1 V/1.2 V/1.5 V/1.8 V/2.5 V/3.0 V I/O
Transceiver Count β€” Up to 12 channels
Max Transceiver Data Rate β€” 6.375 Gbps
DSP Blocks β€” 484 (18x18 multipliers)
Embedded Hard IP β€” PCI Express Gen1/Gen2 endpoint/root-port
Memory Interfaces β€” DDR3 SDRAM up to 800 Mbps, DDR2, QDR II+
Process Technology β€” 40 nm TSMC
MSL Level β€” [DATA_NEEDED: MSL rating]

Datasheets & Resources

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