EP2AGX95EF35C6 vs EP2AGX95EF35I3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX95EF35C6 sa pamamagitan ng Intel at EP2AGX95EF35I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGX95EF35C6 EP2AGX95EF35I3G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Device Family Arria II GX —
Logic Elements (LEs) 89,178 —
Maximum User I/O Pins 452 —
Embedded Memory (Kbits) 4,478 —
Embedded 18x18 Multipliers 612 —
Number of Transceivers 8 —
Maximum Transceiver Data Rate 3.75 Gbps —
Packhaging 1152-ball FCBGA 1152-BBGA, FCBGA
Speed Grade -6 (mid) —
Process Node 40 nm —
PCIe Hard IP PCIe Gen1/Gen2 (x1/x4/x8) - per family datasheet —
Hanay ng Temperature na Operasyon Commercial (0C to 85C) per 'C' suffix —
Configuration Modes Active Serial, Passive Serial, Fast Passive Parallel, JTAG —
Uri ng Pagpapasok Surface Mount (FCBGA) Surface Mount
Tindminan RoHS Compliant Compliant
Series — Arria II GX
Logic Elements — 89,178
Total RAM Bits — 6,839,296
Number of LABs/CLBs — 452
User I/O Count — 452
Temperature na Operasyon — -40C to +100C (Industrial)
Volte ng Pagbibigay — 0.9 V core, 1.1 V/1.2 V/1.5 V/1.8 V/2.5 V/3.0 V I/O
Transceiver Count — Up to 12 channels
Max Transceiver Data Rate — 6.375 Gbps
DSP Blocks — 484 (18x18 multipliers)
Embedded Hard IP — PCI Express Gen1/Gen2 endpoint/root-port
Memory Interfaces — DDR3 SDRAM up to 800 Mbps, DDR2, QDR II+
Process Technology — 40 nm TSMC
Level ng MSL — [DATA_NEEDED: MSL rating]

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