EP2C70F672C7N vs EP2C70F672C6N Comparison
Detailed side-by-side comparison of EP2C70F672C7N by Intel and EP2C70F672C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2C70F672C7N | EP2C70F672C6N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | NRND |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 68,416 | — |
| Total Memory Bits | 1,152,000 | — |
| Embedded Multipliers (18x18) | 150 | — |
| Maximum User I/O | 422 | 422 |
| User I/O Banks | 8 | — |
| PLLs | 4 | 4 |
| Package | 672-BGA (FBGA-672) | 672-ball FBGA, 27x27 mm, 1.0 mm pitch |
| Process Technology | 90 nm CMOS | 90 nm low-k CMOS, copper interconnect |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | C7 (slower, lower-power variant) | C6 |
| Supply Voltage - Core | 1.15 V to 1.25 V (internal) | — |
| Supply Voltage - I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-standard) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS Status | Compliant (lead-free FBGA) | Lead-free (per FBGA marking) |
| MSL Level | 3 (per JEDEC J-STD-020) | — |
| Configuration Method | Serial (AS) or Parallel (PS) via Altera EPCS/EPC configuration devices | — |
| Series | — | EP2C70 |
| Logic Elements | — | 68,416 |
| Logic Array Blocks (LABs) | — | 4,276 |
| Total RAM Bits | — | 1,152,000 |
| Embedded 18x18 Multipliers | — | 150 |
| I/O Banks | — | 8 |
| Configuration Memory | — | SRAM (volatile) |
| Configuration Schemes | — | AS, AP, PS, JTAG |
| Supported I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |