EP2C70F672C7N vs EP2C70F672C6N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2C70F672C7N disebabkan oleh Intel dan EP2C70F672C6N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2C70F672C7N | EP2C70F672C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 68,416 | — |
| Total Memory Bits | 1,152,000 | — |
| Embedded Multipliers (18x18) | 150 | — |
| Maximum User I/O | 422 | 422 |
| User I/O Banks | 8 | — |
| PLLs | 4 | 4 |
| Kemasan | 672-BGA (FBGA-672) | 672-ball FBGA, 27x27 mm, 1.0 mm pitch |
| Process Technology | 90 nm CMOS | 90 nm low-k CMOS, copper interconnect |
| Suhu Operasi | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | C7 (slower, lower-power variant) | C6 |
| Supply Voltage - Core | 1.15 V to 1.25 V (internal) | — |
| Supply Voltage - I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-standard) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant (lead-free FBGA) | Lead-free (per FBGA marking) |
| Aras MSL | 3 (per JEDEC J-STD-020) | — |
| Configuration Method | Serial (AS) or Parallel (PS) via Altera EPCS/EPC configuration devices | — |
| Series | — | EP2C70 |
| Logic Elements | — | 68,416 |
| Logic Array Blocks (LABs) | — | 4,276 |
| Total RAM Bits | — | 1,152,000 |
| Embedded 18x18 Multipliers | — | 150 |
| I/O Banks | — | 8 |
| Configuration Memory | — | SRAM (volatile) |
| Configuration Schemes | — | AS, AP, PS, JTAG |
| Supported I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |