EP2C70F672C7N vs EP2C70F672C6N Perbandingan
Perbandingan bersamaan detil EP2C70F672C7N dari Intel dan EP2C70F672C6N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2C70F672C7N | EP2C70F672C6N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 68,416 | — |
| Total Memory Bits | 1,152,000 | — |
| Embedded Multipliers (18x18) | 150 | — |
| Maximum User I/O | 422 | 422 |
| User I/O Banks | 8 | — |
| PLLs | 4 | 4 |
| Paket | 672-BGA (FBGA-672) | 672-ball FBGA, 27x27 mm, 1.0 mm pitch |
| Process Technology | 90 nm CMOS | 90 nm low-k CMOS, copper interconnect |
| Suhu Kerja | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | C7 (slower, lower-power variant) | C6 |
| Supply Voltage - Core | 1.15 V to 1.25 V (internal) | — |
| Supply Voltage - I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-standard) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant (lead-free FBGA) | Lead-free (per FBGA marking) |
| Level MSL | 3 (per JEDEC J-STD-020) | — |
| Configuration Method | Serial (AS) or Parallel (PS) via Altera EPCS/EPC configuration devices | — |
| Series | — | EP2C70 |
| Logic Elements | — | 68,416 |
| Logic Array Blocks (LABs) | — | 4,276 |
| Total RAM Bits | — | 1,152,000 |
| Embedded 18x18 Multipliers | — | 150 |
| I/O Banks | — | 8 |
| Configuration Memory | — | SRAM (volatile) |
| Configuration Schemes | — | AS, AP, PS, JTAG |
| Supported I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |