EP2C70F672C7N vs EP2C70F672C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2C70F672C7N sa pamamagitan ng Intel at EP2C70F672C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2C70F672C7N | EP2C70F672C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 68,416 | — |
| Total Memory Bits | 1,152,000 | — |
| Embedded Multipliers (18x18) | 150 | — |
| Maximum User I/O | 422 | 422 |
| User I/O Banks | 8 | — |
| PLLs | 4 | 4 |
| Packhaging | 672-BGA (FBGA-672) | 672-ball FBGA, 27x27 mm, 1.0 mm pitch |
| Process Technology | 90 nm CMOS | 90 nm low-k CMOS, copper interconnect |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | C7 (slower, lower-power variant) | C6 |
| Supply Voltage - Core | 1.15 V to 1.25 V (internal) | — |
| Supply Voltage - I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-standard) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant (lead-free FBGA) | Lead-free (per FBGA marking) |
| Level ng MSL | 3 (per JEDEC J-STD-020) | — |
| Configuration Method | Serial (AS) or Parallel (PS) via Altera EPCS/EPC configuration devices | — |
| Series | — | EP2C70 |
| Logic Elements | — | 68,416 |
| Logic Array Blocks (LABs) | — | 4,276 |
| Total RAM Bits | — | 1,152,000 |
| Embedded 18x18 Multipliers | — | 150 |
| I/O Banks | — | 8 |
| Configuration Memory | — | SRAM (volatile) |
| Configuration Schemes | — | AS, AP, PS, JTAG |
| Supported I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |