EP2SGX60EF1152I3N vs EP2SGX60EF1162I4N Comparison

Detailed side-by-side comparison of EP2SGX60EF1152I3N by Intel and EP2SGX60EF1162I4N by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX60EF1152I3N EP2SGX60EF1162I4N
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $1,195.00 $392.00
Family Stratix II GX Stratix II GX
Device Type Field-Programmable Gate Array (FPGA) β€”
Logic Elements (LEs) 60,440 β€”
Configurable Logic Blocks (CLBs) 60,440 β€”
Embedded Memory Bits 2,544,192 bits β€”
Internal Frequency (max) 717 MHz β€”
Process Technology 90 nm β€”
Core Voltage 1.2 V 1.2 V
Package Type 1152-ball FC-FBGA β€”
Package Size 35 x 35 mm (1 mm ball pitch) β€”
Number of Terminals 1152 β€”
Terminal Form Ball β€”
Temperature Grade Industrial (-40C to +100C junction) β€”
Lead-Free Yes β€”
RoHS Status Compliant Compliant
MSL Level [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Logic Elements β€” 60,440
Adaptive Logic Modules (ALMs) β€” 24,176
Embedded Memory β€” 2,544,192 bits
DSP Blocks β€” 12
18x18 Multipliers β€” 252
User I/Os β€” 534
Transceivers β€” Up to 20 (600 Mbps to 6.375 Gbps)
PLLs β€” 4
Global Clock Networks β€” 16
Package β€” 1162-ball FineLine BGA, 35 mm x 35 mm, 1.0 mm pitch
Speed Grade β€” I4 (industrial)
Temperature Range β€” -40C to +100C (junction)
Configuration Mode β€” Enhanced (EPC) / Fast Passive Parallel (FPP)
Process Node β€” 90 nm

Datasheets & Resources

Browse All Products Create BOM Request Quote