EP2SGX60EF1152I3N vs EP2SGX60EF1162I4N Comparación
Comparación detallada lado a lado de EP2SGX60EF1152I3N por Intel y EP2SGX60EF1162I4N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2SGX60EF1152I3N | EP2SGX60EF1162I4N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.195,00 | $392,00 |
| Family | Stratix II GX | Stratix II GX |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| Logic Elements (LEs) | 60,440 | — |
| Configurable Logic Blocks (CLBs) | 60,440 | — |
| Embedded Memory Bits | 2,544,192 bits | — |
| Internal Frequency (max) | 717 MHz | — |
| Process Technology | 90 nm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Package Type | 1152-ball FC-FBGA | — |
| Package Size | 35 x 35 mm (1 mm ball pitch) | — |
| Number of Terminals | 1152 | — |
| Terminal Form | Ball | — |
| Temperature Grade | Industrial (-40C to +100C junction) | — |
| Lead-Free | Yes | — |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements | — | 60,440 |
| Adaptive Logic Modules (ALMs) | — | 24,176 |
| Embedded Memory | — | 2,544,192 bits |
| DSP Blocks | — | 12 |
| 18x18 Multipliers | — | 252 |
| User I/Os | — | 534 |
| Transceivers | — | Up to 20 (600 Mbps to 6.375 Gbps) |
| PLLs | — | 4 |
| Global Clock Networks | — | 16 |
| Encapsulado | — | 1162-ball FineLine BGA, 35 mm x 35 mm, 1.0 mm pitch |
| Speed Grade | — | I4 (industrial) |
| Temperature Range | — | -40C to +100C (junction) |
| Configuration Mode | — | Enhanced (EPC) / Fast Passive Parallel (FPP) |
| Process Node | — | 90 nm |