EP2SGX60EF1152I3N vs EP2SGX60EF1162I4N Vergleich
Detaillierter Direktvergleich von EP2SGX60EF1152I3N von Intel und EP2SGX60EF1162I4N von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2SGX60EF1152I3N | EP2SGX60EF1162I4N |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.195,00 | $392,00 |
| Family | Stratix II GX | Stratix II GX |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| Logic Elements (LEs) | 60,440 | — |
| Configurable Logic Blocks (CLBs) | 60,440 | — |
| Embedded Memory Bits | 2,544,192 bits | — |
| Internal Frequency (max) | 717 MHz | — |
| Process Technology | 90 nm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Package Type | 1152-ball FC-FBGA | — |
| Package Size | 35 x 35 mm (1 mm ball pitch) | — |
| Number of Terminals | 1152 | — |
| Terminal Form | Ball | — |
| Temperature Grade | Industrial (-40C to +100C junction) | — |
| Lead-Free | Yes | — |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements | — | 60,440 |
| Adaptive Logic Modules (ALMs) | — | 24,176 |
| Embedded Memory | — | 2,544,192 bits |
| DSP Blocks | — | 12 |
| 18x18 Multipliers | — | 252 |
| User I/Os | — | 534 |
| Transceivers | — | Up to 20 (600 Mbps to 6.375 Gbps) |
| PLLs | — | 4 |
| Global Clock Networks | — | 16 |
| Gehäuse | — | 1162-ball FineLine BGA, 35 mm x 35 mm, 1.0 mm pitch |
| Speed Grade | — | I4 (industrial) |
| Temperature Range | — | -40C to +100C (junction) |
| Configuration Mode | — | Enhanced (EPC) / Fast Passive Parallel (FPP) |
| Process Node | — | 90 nm |