EP2SGX60EF1152I3N vs EP2SGX60EF1162I4N 对比

详细并排对比 EP2SGX60EF1152I3N 出自 Intel 和 EP2SGX60EF1162I4N 出自 Altera。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP2SGX60EF1152I3N EP2SGX60EF1162I4N
品牌 Intel Altera
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete 不推荐新设计
库存状态 有库存 有库存
单价(USD) $1,195.00 $392.00
Family Stratix II GX Stratix II GX
Device Type Field-Programmable Gate Array (FPGA) —
Logic Elements (LEs) 60,440 —
Configurable Logic Blocks (CLBs) 60,440 —
Embedded Memory Bits 2,544,192 bits —
Internal Frequency (max) 717 MHz —
Process Technology 90 nm —
Core Voltage 1.2 V 1.2 V
Package Type 1152-ball FC-FBGA —
Package Size 35 x 35 mm (1 mm ball pitch) —
Number of Terminals 1152 —
Terminal Form Ball —
Temperature Grade Industrial (-40C to +100C junction) —
Lead-Free Yes —
RoHS 状态 Compliant Compliant
MSL 等级 [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
安装类型 Surface Mount (BGA) Surface Mount (BGA)
Logic Elements — 60,440
Adaptive Logic Modules (ALMs) — 24,176
Embedded Memory — 2,544,192 bits
DSP Blocks — 12
18x18 Multipliers — 252
User I/Os — 534
Transceivers — Up to 20 (600 Mbps to 6.375 Gbps)
PLLs — 4
Global Clock Networks — 16
封装 — 1162-ball FineLine BGA, 35 mm x 35 mm, 1.0 mm pitch
Speed Grade — I4 (industrial)
Temperature Range — -40C to +100C (junction)
Configuration Mode — Enhanced (EPC) / Fast Passive Parallel (FPP)
Process Node — 90 nm

数据手册与资源

浏览全部产品 创建 BOM 获取报价