EP3C10F256I7N vs EP3C10F256I7 Comparison
Detailed side-by-side comparison of EP3C10F256I7N by Intel and EP3C10F256I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C10F256I7N | EP3C10F256I7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | NRND |
| Family | Cyclone III | — |
| Device Type | FPGA | Cyclone III Field Programmable Gate Array (FPGA) |
| Logic Elements (LE) | 10,320 | — |
| Logic Blocks | 10,320 | — |
| Embedded Memory | 423,936 bits | 423,936 bits |
| Total Memory Bits | 423,936 | — |
| Maximum User I/O | 182 | — |
| Embedded 18x18 Multipliers | 46 | — |
| PLLs | 2 | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.2 V | [DATA_NEEDED: core voltage] |
| Package | 256-LBGA (FineLine BGA) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40C to +125C (Industrial) | -40°C to +125°C |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Lead Free | Yes | — |
| MSL Level | 3 | — |
| Logic Cells | — | 10,320 logic cells |
| I/O Count | — | 182 I/O pins |
| Total Terminals | — | 256 terminals |
| Package Type | — | 256-LBGA |
| Package Family | — | LBGA |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Temperature Grade | — | Industrial |
| Supply Voltage | — | [DATA_NEEDED: supply voltage range] |
| I/O Standard | — | [DATA_NEEDED: supported I/O standards] |
| Configuration Interface | — | [DATA_NEEDED: configuration interfaces] |
| Lead-Free Status | — | Lead Free |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Manufacturer Family | — | Cyclone III |
| Logic Block Count | — | 10,320 logic blocks |