EP3C10F256I7N vs EP3C10F256I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C10F256I7N sa pamamagitan ng Intel at EP3C10F256I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C10F256I7N | EP3C10F256I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Cyclone III | — |
| Device Type | FPGA | Cyclone III Field Programmable Gate Array (FPGA) |
| Logic Elements (LE) | 10,320 | — |
| Logic Blocks | 10,320 | — |
| Embedded Memory | 423,936 bits | 423,936 bits |
| Total Memory Bits | 423,936 | — |
| Maximum User I/O | 182 | — |
| Embedded 18x18 Multipliers | 46 | — |
| PLLs | 2 | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.2 V | [DATA_NEEDED: core voltage] |
| Packhaging | 256-LBGA (FineLine BGA) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +125C (Industrial) | -40°C to +125°C |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead Free | Yes | — |
| Level ng MSL | 3 | — |
| Logic Cells | — | 10,320 logic cells |
| I/O Count | — | 182 I/O pins |
| Total Terminals | — | 256 terminals |
| Package Type | — | 256-LBGA |
| Package Family | — | LBGA |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Temperature Grade | — | Industrial |
| Volte ng Pagbibigay | — | [DATA_NEEDED: supply voltage range] |
| I/O Standard | — | [DATA_NEEDED: supported I/O standards] |
| Configuration Interface | — | [DATA_NEEDED: configuration interfaces] |
| Lead-Free Status | — | Lead Free |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Manufacturer Family | — | Cyclone III |
| Logic Block Count | — | 10,320 logic blocks |