EP3C10F256I7N vs EP3C10F256I7 对比
详细并排对比 EP3C10F256I7N 出自 Intel 和 EP3C10F256I7 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3C10F256I7N | EP3C10F256I7 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 不推荐新设计 |
| Family | Cyclone III | — |
| Device Type | FPGA | Cyclone III Field Programmable Gate Array (FPGA) |
| Logic Elements (LE) | 10,320 | — |
| Logic Blocks | 10,320 | — |
| Embedded Memory | 423,936 bits | 423,936 bits |
| Total Memory Bits | 423,936 | — |
| Maximum User I/O | 182 | — |
| Embedded 18x18 Multipliers | 46 | — |
| PLLs | 2 | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.2 V | [DATA_NEEDED: core voltage] |
| 封装 | 256-LBGA (FineLine BGA) | — |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | -40C to +125C (Industrial) | -40°C to +125°C |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS status] |
| Lead Free | Yes | — |
| MSL 等级 | 3 | — |
| Logic Cells | — | 10,320 logic cells |
| I/O Count | — | 182 I/O pins |
| Total Terminals | — | 256 terminals |
| Package Type | — | 256-LBGA |
| Package Family | — | LBGA |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Temperature Grade | — | Industrial |
| 电源电压 | — | [DATA_NEEDED: supply voltage range] |
| I/O Standard | — | [DATA_NEEDED: supported I/O standards] |
| Configuration Interface | — | [DATA_NEEDED: configuration interfaces] |
| Lead-Free Status | — | Lead Free |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Manufacturer Family | — | Cyclone III |
| Logic Block Count | — | 10,320 logic blocks |