EP3C10F256I7N vs EP3C10F256I7 Vergleich
Detaillierter Direktvergleich von EP3C10F256I7N von Intel und EP3C10F256I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C10F256I7N | EP3C10F256I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Family | Cyclone III | — |
| Device Type | FPGA | Cyclone III Field Programmable Gate Array (FPGA) |
| Logic Elements (LE) | 10,320 | — |
| Logic Blocks | 10,320 | — |
| Embedded Memory | 423,936 bits | 423,936 bits |
| Total Memory Bits | 423,936 | — |
| Maximum User I/O | 182 | — |
| Embedded 18x18 Multipliers | 46 | — |
| PLLs | 2 | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.2 V | [DATA_NEEDED: core voltage] |
| Gehäuse | 256-LBGA (FineLine BGA) | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40C to +125C (Industrial) | -40°C to +125°C |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Lead Free | Yes | — |
| MSL-Level | 3 | — |
| Logic Cells | — | 10,320 logic cells |
| I/O Count | — | 182 I/O pins |
| Total Terminals | — | 256 terminals |
| Package Type | — | 256-LBGA |
| Package Family | — | LBGA |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Temperature Grade | — | Industrial |
| Versorgungsspannung | — | [DATA_NEEDED: supply voltage range] |
| I/O Standard | — | [DATA_NEEDED: supported I/O standards] |
| Configuration Interface | — | [DATA_NEEDED: configuration interfaces] |
| Lead-Free Status | — | Lead Free |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Manufacturer Family | — | Cyclone III |
| Logic Block Count | — | 10,320 logic blocks |