EP3C10U256I7 vs EP3C10F256I7 Comparison
Detailed side-by-side comparison of EP3C10U256I7 by Intel and EP3C10F256I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C10U256I7 | EP3C10F256I7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | NRND |
| Device Type | Field-Programmable Gate Array (FPGA) | Cyclone III Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone III | — |
| Logic Cells | 10,320 cells | 10,320 logic cells |
| User I/O Count | 182 I/O | — |
| Embedded RAM | 423,936 bits | — |
| Maximum Frequency | 437.5 MHz | — |
| Process Technology | 65 nm | — |
| Core Supply Voltage | 1.2 V | — |
| Temperature Grade | Industrial | Industrial |
| Package Code | LFBGA | — |
| Package Type | 256-LFBGA | 256-LBGA |
| Terminal Type | Ball | — |
| Terminal Count | 256 balls | — |
| Package Shape | Square | Square |
| Mounting Type | Surface Mount | Surface Mount |
| Programmability | Field Programmable | — |
| Embedded Memory | — | 423,936 bits |
| I/O Count | — | 182 I/O pins |
| Total Terminals | — | 256 terminals |
| Package Family | — | LBGA |
| Terminal Form | — | Ball |
| Operating Temperature | — | -40°C to +125°C |
| Supply Voltage | — | [DATA_NEEDED: supply voltage range] |
| Core Voltage | — | [DATA_NEEDED: core voltage] |
| I/O Standard | — | [DATA_NEEDED: supported I/O standards] |
| Configuration Interface | — | [DATA_NEEDED: configuration interfaces] |
| Lead-Free Status | — | Lead Free |
| RoHS Status | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Manufacturer Family | — | Cyclone III |
| Logic Block Count | — | 10,320 logic blocks |