EP3C10U256I7 vs EP3C10F256I7 Vergleich
Detaillierter Direktvergleich von EP3C10U256I7 von Intel und EP3C10F256I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C10U256I7 | EP3C10F256I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Device Type | Field-Programmable Gate Array (FPGA) | Cyclone III Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone III | — |
| Logic Cells | 10,320 cells | 10,320 logic cells |
| User I/O Count | 182 I/O | — |
| Embedded RAM | 423,936 bits | — |
| Maximum Frequency | 437.5 MHz | — |
| Process Technology | 65 nm | — |
| Core Supply Voltage | 1.2 V | — |
| Temperature Grade | Industrial | Industrial |
| Package Code | LFBGA | — |
| Package Type | 256-LFBGA | 256-LBGA |
| Terminal Type | Ball | — |
| Terminal Count | 256 balls | — |
| Package Shape | Square | Square |
| Montageart | Surface Mount | Surface Mount |
| Programmability | Field Programmable | — |
| Embedded Memory | — | 423,936 bits |
| I/O Count | — | 182 I/O pins |
| Total Terminals | — | 256 terminals |
| Package Family | — | LBGA |
| Terminal Form | — | Ball |
| Betriebstemperatur | — | -40°C to +125°C |
| Versorgungsspannung | — | [DATA_NEEDED: supply voltage range] |
| Core Voltage | — | [DATA_NEEDED: core voltage] |
| I/O Standard | — | [DATA_NEEDED: supported I/O standards] |
| Configuration Interface | — | [DATA_NEEDED: configuration interfaces] |
| Lead-Free Status | — | Lead Free |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Manufacturer Family | — | Cyclone III |
| Logic Block Count | — | 10,320 logic blocks |