EP3C10U256I7 vs EP3C10F256I7 Perbandingan
Perbandingan bersamaan detil EP3C10U256I7 dari Intel dan EP3C10F256I7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C10U256I7 | EP3C10F256I7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Device Type | Field-Programmable Gate Array (FPGA) | Cyclone III Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone III | — |
| Logic Cells | 10,320 cells | 10,320 logic cells |
| User I/O Count | 182 I/O | — |
| Embedded RAM | 423,936 bits | — |
| Maximum Frequency | 437.5 MHz | — |
| Process Technology | 65 nm | — |
| Core Supply Voltage | 1.2 V | — |
| Temperature Grade | Industrial | Industrial |
| Package Code | LFBGA | — |
| Package Type | 256-LFBGA | 256-LBGA |
| Terminal Type | Ball | — |
| Terminal Count | 256 balls | — |
| Package Shape | Square | Square |
| Tipe Mounting | Surface Mount | Surface Mount |
| Programmability | Field Programmable | — |
| Embedded Memory | — | 423,936 bits |
| I/O Count | — | 182 I/O pins |
| Total Terminals | — | 256 terminals |
| Package Family | — | LBGA |
| Terminal Form | — | Ball |
| Suhu Kerja | — | -40°C to +125°C |
| Tegangan Pemuat | — | [DATA_NEEDED: supply voltage range] |
| Core Voltage | — | [DATA_NEEDED: core voltage] |
| I/O Standard | — | [DATA_NEEDED: supported I/O standards] |
| Configuration Interface | — | [DATA_NEEDED: configuration interfaces] |
| Lead-Free Status | — | Lead Free |
| Status RoHS | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Manufacturer Family | — | Cyclone III |
| Logic Block Count | — | 10,320 logic blocks |