EP3C10U256I7 vs EP3C10F256I7 对比
详细并排对比 EP3C10U256I7 出自 Intel 和 EP3C10F256I7 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3C10U256I7 | EP3C10F256I7 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 不推荐新设计 |
| Device Type | Field-Programmable Gate Array (FPGA) | Cyclone III Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone III | — |
| Logic Cells | 10,320 cells | 10,320 logic cells |
| User I/O Count | 182 I/O | — |
| Embedded RAM | 423,936 bits | — |
| Maximum Frequency | 437.5 MHz | — |
| Process Technology | 65 nm | — |
| Core Supply Voltage | 1.2 V | — |
| Temperature Grade | Industrial | Industrial |
| Package Code | LFBGA | — |
| Package Type | 256-LFBGA | 256-LBGA |
| Terminal Type | Ball | — |
| Terminal Count | 256 balls | — |
| Package Shape | Square | Square |
| 安装类型 | Surface Mount | Surface Mount |
| Programmability | Field Programmable | — |
| Embedded Memory | — | 423,936 bits |
| I/O Count | — | 182 I/O pins |
| Total Terminals | — | 256 terminals |
| Package Family | — | LBGA |
| Terminal Form | — | Ball |
| 工作温度 | — | -40°C to +125°C |
| 电源电压 | — | [DATA_NEEDED: supply voltage range] |
| Core Voltage | — | [DATA_NEEDED: core voltage] |
| I/O Standard | — | [DATA_NEEDED: supported I/O standards] |
| Configuration Interface | — | [DATA_NEEDED: configuration interfaces] |
| Lead-Free Status | — | Lead Free |
| RoHS 状态 | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Manufacturer Family | — | Cyclone III |
| Logic Block Count | — | 10,320 logic blocks |