EP3C16E144I7 vs EP3C16E144I7N Comparison

Detailed side-by-side comparison of EP3C16E144I7 by Intel and EP3C16E144I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C16E144I7 EP3C16E144I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Logic Cells 15,408 —
I/O Count 84 —
Package 144-LQFP Exposed Pad 144-LQFP Exposed Pad (EQFP-144)
Package Code LFQFP —
Package Body Size 20 x 20 mm —
Package Pitch 0.40 mm —
Pin Count 144 —
Terminal Type Gull wing —
Package Shape Square —
Temperature Grade Industrial —
Mounting Type Surface Mount Surface Mount
Embedded Memory [DATA_NEEDED: embedded memory specification] —
Core Supply Voltage [DATA_NEEDED: core supply voltage] —
I/O Supply Voltage [DATA_NEEDED: I/O supply voltage] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Configuration Interface [DATA_NEEDED: configuration interface] —
RoHS Status [DATA_NEEDED: RoHS status] —
Series — Cyclone III
Logic Elements — 15,408
Total RAM Bits — 516,096 bits
Maximum User I/O — 84
Number of Logic Array Blocks (LABs) — 963
Embedded 18x18 Multipliers — 56
PLLs — 4
Global Clock Networks — 20
Core Voltage — 1.2 V
I/O Bank Voltage Support — 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V
Operating Temperature — -40C to +100C (industrial, junction)
Speed Grade — 7 (I7)
Lead-Free / RoHS — Yes (lead-free finish, RoHS compliant per manufacturer product page)
Process Technology — 65 nm low-power CMOS
Configuration Scheme — Active serial, passive serial, JTAG

Datasheets & Resources

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