EP3C16E144I7 vs EP3C16E144I7N Vergleich

Detaillierter Direktvergleich von EP3C16E144I7 von Intel und EP3C16E144I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C16E144I7 EP3C16E144I7N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Logic Cells 15,408 —
I/O Count 84 —
Gehäuse 144-LQFP Exposed Pad 144-LQFP Exposed Pad (EQFP-144)
Package Code LFQFP —
Package Body Size 20 x 20 mm —
Package Pitch 0.40 mm —
Pin-Anzahl 144 —
Terminal Type Gull wing —
Package Shape Square —
Temperature Grade Industrial —
Montageart Surface Mount Surface Mount
Embedded Memory [DATA_NEEDED: embedded memory specification] —
Core Supply Voltage [DATA_NEEDED: core supply voltage] —
I/O Supply Voltage [DATA_NEEDED: I/O supply voltage] —
Betriebstemperaturbereich [DATA_NEEDED: operating temperature range] —
Configuration Interface [DATA_NEEDED: configuration interface] —
RoHS-Status [DATA_NEEDED: RoHS status] —
Series — Cyclone III
Logic Elements — 15,408
Total RAM Bits — 516,096 bits
Maximum User I/O — 84
Number of Logic Array Blocks (LABs) — 963
Embedded 18x18 Multipliers — 56
PLLs — 4
Global Clock Networks — 20
Core Voltage — 1.2 V
I/O Bank Voltage Support — 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V
Betriebstemperatur — -40C to +100C (industrial, junction)
Speed Grade — 7 (I7)
Lead-Free / RoHS — Yes (lead-free finish, RoHS compliant per manufacturer product page)
Process Technology — 65 nm low-power CMOS
Configuration Scheme — Active serial, passive serial, JTAG

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