EP3C16E144I7 vs EP3C16E144I7N Comparación
Comparación detallada lado a lado de EP3C16E144I7 por Intel y EP3C16E144I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C16E144I7 | EP3C16E144I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| FPGA Family | Cyclone III | — |
| Logic Cells | 15,408 | — |
| I/O Count | 84 | — |
| Encapsulado | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad (EQFP-144) |
| Package Code | LFQFP | — |
| Package Body Size | 20 x 20 mm | — |
| Package Pitch | 0.40 mm | — |
| Recuento de pines | 144 | — |
| Terminal Type | Gull wing | — |
| Package Shape | Square | — |
| Temperature Grade | Industrial | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Embedded Memory | [DATA_NEEDED: embedded memory specification] | — |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage] | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Configuration Interface | [DATA_NEEDED: configuration interface] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Series | — | Cyclone III |
| Logic Elements | — | 15,408 |
| Total RAM Bits | — | 516,096 bits |
| Maximum User I/O | — | 84 |
| Number of Logic Array Blocks (LABs) | — | 963 |
| Embedded 18x18 Multipliers | — | 56 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| I/O Bank Voltage Support | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Temperatura de funcionamiento | — | -40C to +100C (industrial, junction) |
| Speed Grade | — | 7 (I7) |
| Lead-Free / RoHS | — | Yes (lead-free finish, RoHS compliant per manufacturer product page) |
| Process Technology | — | 65 nm low-power CMOS |
| Configuration Scheme | — | Active serial, passive serial, JTAG |