EP3C16F256I7N vs EP3C5F256C6 Comparison
Detailed side-by-side comparison of EP3C16F256I7N by Intel and EP3C5F256C6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C16F256I7N | EP3C5F256C6 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $38.50 | $21.40 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 15408 | β |
| Logic Array Blocks (LABs) | 963 | 5136 / 342 (per ADatasheet summary) |
| Total Memory Bits | 516096 | 423,936 bits |
| Embedded Memory | 56 M9K blocks (504 Kbit) | M9K blocks (per Cyclone III family) |
| Embedded 18x18 Multipliers | 56 | 23 |
| PLLs | 4 | 4 |
| Maximum User I/O Pins | 168 | β |
| Package | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch |
| Operating Temperature | -40C to +100C (industrial, I7) | β |
| Supply Voltage (Core) | 1.2 V typical | β |
| Process Technology | TSMC 60 nm low-leakage | 65 nm CMOS, low-k |
| Configuration | SRAM-based, requires external config device (EPCS/EPCQ) | β |
| Lead-Free / Pb-Free | Yes (N suffix per JEDEC JESD97) | β |
| RoHS Compliance | Compliant | β |
| Logic Elements (LE) | β | 5,136 |
| User I/Os | β | 182 |
| Global Clock Networks | β | 20 |
| Core Voltage | β | 1.15 V to 1.25 V (typical 1.2 V) |
| Maximum Operating Frequency | β | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] |
| Mounting Type | β | Surface Mount |
| Operating Temperature (Commercial) | β | 0C to +85C (per device suffix C6) |
| Configuration Modes | β | AS, PS, JTAG |
| RoHS Status | β | Compliant (lead-free per FBGA package) |