EP3C16F256I7N vs EP3C5F256C6 Comparación
Comparación detallada lado a lado de EP3C16F256I7N por Intel y EP3C5F256C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C16F256I7N | EP3C5F256C6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $38,50 | $21,40 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 15408 | — |
| Logic Array Blocks (LABs) | 963 | 5136 / 342 (per ADatasheet summary) |
| Total Memory Bits | 516096 | 423,936 bits |
| Embedded Memory | 56 M9K blocks (504 Kbit) | M9K blocks (per Cyclone III family) |
| Embedded 18x18 Multipliers | 56 | 23 |
| PLLs | 4 | 4 |
| Maximum User I/O Pins | 168 | — |
| Encapsulado | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch |
| Temperatura de funcionamiento | -40C to +100C (industrial, I7) | — |
| Supply Voltage (Core) | 1.2 V typical | — |
| Process Technology | TSMC 60 nm low-leakage | 65 nm CMOS, low-k |
| Configuration | SRAM-based, requires external config device (EPCS/EPCQ) | — |
| Lead-Free / Pb-Free | Yes (N suffix per JEDEC JESD97) | — |
| RoHS Compliance | Compliant | — |
| Logic Elements (LE) | — | 5,136 |
| User I/Os | — | 182 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.15 V to 1.25 V (typical 1.2 V) |
| Maximum Operating Frequency | — | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] |
| Tipo de montaje | — | Surface Mount |
| Operating Temperature (Commercial) | — | 0C to +85C (per device suffix C6) |
| Configuration Modes | — | AS, PS, JTAG |
| Estado RoHS | — | Compliant (lead-free per FBGA package) |