EP3C16F256I7N vs EP3C5F256C6 Vergleich
Detaillierter Direktvergleich von EP3C16F256I7N von Intel und EP3C5F256C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C16F256I7N | EP3C5F256C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $38,50 | $21,40 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 15408 | — |
| Logic Array Blocks (LABs) | 963 | 5136 / 342 (per ADatasheet summary) |
| Total Memory Bits | 516096 | 423,936 bits |
| Embedded Memory | 56 M9K blocks (504 Kbit) | M9K blocks (per Cyclone III family) |
| Embedded 18x18 Multipliers | 56 | 23 |
| PLLs | 4 | 4 |
| Maximum User I/O Pins | 168 | — |
| Gehäuse | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch |
| Betriebstemperatur | -40C to +100C (industrial, I7) | — |
| Supply Voltage (Core) | 1.2 V typical | — |
| Process Technology | TSMC 60 nm low-leakage | 65 nm CMOS, low-k |
| Configuration | SRAM-based, requires external config device (EPCS/EPCQ) | — |
| Lead-Free / Pb-Free | Yes (N suffix per JEDEC JESD97) | — |
| RoHS Compliance | Compliant | — |
| Logic Elements (LE) | — | 5,136 |
| User I/Os | — | 182 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.15 V to 1.25 V (typical 1.2 V) |
| Maximum Operating Frequency | — | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] |
| Montageart | — | Surface Mount |
| Operating Temperature (Commercial) | — | 0C to +85C (per device suffix C6) |
| Configuration Modes | — | AS, PS, JTAG |
| RoHS-Status | — | Compliant (lead-free per FBGA package) |