EP3C25F256C7 vs EP3C25F256I7N Comparison

Detailed side-by-side comparison of EP3C25F256C7 by Altera and EP3C25F256I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C25F256C7 EP3C25F256I7N
Brand Altera Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Active
Device Type Field Programmable Gate Array (FPGA) FPGA
FPGA Family Cyclone III —
Logic Elements 24,624 logic elements 24,624
Logic Blocks 156 logic blocks —
Embedded Memory 608,256 bits 608,256 bits
Package Type 256-LBGA —
Alternate Package Designation FBGA-256 —
Pin Count 256 pins —
Number of Terminations 256 terminations —
Operating Temperature -40°C to +125°C -40C to +125C
Mounting Type Surface Mount Surface Mount
Lead-Free Status Lead-free package —
Core Supply Voltage [DATA_NEEDED: core supply voltage] 1.2 V
I/O Supply Voltage [DATA_NEEDED: I/O supply voltage] —
Maximum Clock Frequency [DATA_NEEDED: maximum clock frequency] —
Active Power Consumption [DATA_NEEDED: active power consumption] —
Quiescent Power Consumption [DATA_NEEDED: quiescent power consumption] —
Configuration Interface [DATA_NEEDED: configuration interface] —
Supported I/O Standards [DATA_NEEDED: supported I/O standards] —
RoHS Status [DATA_NEEDED: RoHS status] Compliant (lead-free)
REACH Status [DATA_NEEDED: REACH status] —
Family — Cyclone III
Embedded Multipliers — 66 (18x18)
Maximum User I/O — 156
Package — 256-FBGA (FineLine BGA)
Speed Grade — 7
Process Technology — 65 nm low-power
PLLs — 4 general-purpose PLLs
External Memory Support — DDR/DDR2/QDRII/QDRII+
Hot Socketing — Supported
Configuration — SRAM-based, in-system programmable

Datasheets & Resources

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