EP3C25F256C7 vs EP3C25F256I7N Vergleich

Detaillierter Direktvergleich von EP3C25F256C7 von Altera und EP3C25F256I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C25F256C7 EP3C25F256I7N
Marke Altera Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Aktiv
Device Type Field Programmable Gate Array (FPGA) FPGA
FPGA Family Cyclone III —
Logic Elements 24,624 logic elements 24,624
Logic Blocks 156 logic blocks —
Embedded Memory 608,256 bits 608,256 bits
Package Type 256-LBGA —
Alternate Package Designation FBGA-256 —
Pin-Anzahl 256 pins —
Number of Terminations 256 terminations —
Betriebstemperatur -40°C to +125°C -40C to +125C
Montageart Surface Mount Surface Mount
Lead-Free Status Lead-free package —
Core Supply Voltage [DATA_NEEDED: core supply voltage] 1.2 V
I/O Supply Voltage [DATA_NEEDED: I/O supply voltage] —
Maximale Taktfrequenz [DATA_NEEDED: maximum clock frequency] —
Active Power Consumption [DATA_NEEDED: active power consumption] —
Quiescent Power Consumption [DATA_NEEDED: quiescent power consumption] —
Configuration Interface [DATA_NEEDED: configuration interface] —
Supported I/O Standards [DATA_NEEDED: supported I/O standards] —
RoHS-Status [DATA_NEEDED: RoHS status] Compliant (lead-free)
REACH Status [DATA_NEEDED: REACH status] —
Family — Cyclone III
Embedded Multipliers — 66 (18x18)
Maximum User I/O — 156
Gehäuse — 256-FBGA (FineLine BGA)
Speed Grade — 7
Process Technology — 65 nm low-power
PLLs — 4 general-purpose PLLs
External Memory Support — DDR/DDR2/QDRII/QDRII+
Hot Socketing — Supported
Configuration — SRAM-based, in-system programmable

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