EP3C25F256I7N vs EP3C16F256I7N Comparison
Detailed side-by-side comparison of EP3C25F256I7N by Intel and EP3C16F256I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C25F256I7N | EP3C16F256I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | FPGA | — |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 24,624 | — |
| Embedded Memory | 608,256 bits | 56 M9K blocks (504 Kbit) |
| Embedded Multipliers | 66 (18x18) | — |
| Maximum User I/O | 156 | — |
| Core Supply Voltage | 1.2 V | — |
| Package | 256-FBGA (FineLine BGA) | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Operating Temperature | -40C to +125C | -40C to +100C (industrial, I7) |
| Speed Grade | 7 | — |
| Process Technology | 65 nm low-power | TSMC 60 nm low-leakage |
| PLLs | 4 general-purpose PLLs | 4 |
| External Memory Support | DDR/DDR2/QDRII/QDRII+ | — |
| Mounting Type | Surface Mount | — |
| RoHS Status | Compliant (lead-free) | — |
| Hot Socketing | Supported | — |
| Configuration | SRAM-based, in-system programmable | SRAM-based, requires external config device (EPCS/EPCQ) |
| Logic Elements (LEs) | — | 15408 |
| Logic Array Blocks (LABs) | — | 963 |
| Total Memory Bits | — | 516096 |
| Embedded 18x18 Multipliers | — | 56 |
| Maximum User I/O Pins | — | 168 |
| Supply Voltage (Core) | — | 1.2 V typical |
| Lead-Free / Pb-Free | — | Yes (N suffix per JEDEC JESD97) |
| RoHS Compliance | — | Compliant |